发明申请
- 专利标题: MULTI-SPEED SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- 专利标题(中): 多速基板加工设备和基板处理方法
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申请号: US12208992申请日: 2008-09-11
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公开(公告)号: US20090071940A1公开(公告)日: 2009-03-19
- 发明人: Tadashi Miyagi , Masashi Kanaoka , Kazuhito Shigemori , Shuichi Yasuda , Masakazu Sanada
- 申请人: Tadashi Miyagi , Masashi Kanaoka , Kazuhito Shigemori , Shuichi Yasuda , Masakazu Sanada
- 申请人地址: JP Kyoto
- 专利权人: SOKUDO CO., LTD.
- 当前专利权人: SOKUDO CO., LTD.
- 当前专利权人地址: JP Kyoto
- 优先权: JPJP2007-237701 20070913
- 主分类号: C23F1/00
- IPC分类号: C23F1/00 ; C23F1/08
摘要:
After a development liquid on a substrate is washed away with a rinse liquid, the rotational speed of the substrate is reduced, so that a liquid layer of the rinse liquid is formed over a top surface of the substrate. Thereafter, the rotational speed of the substrate is increased. The increase in the rotational speed of the substrate causes a centrifugal force to be slightly greater than tension, thereby causing the liquid layer to be held on the substrate with the thickness thereof in its peripheral portion increased and the thickness thereof at the center thereof decreased. Then, gas is discharged toward the center of the liquid layer from a gas supply nozzle, so that a hole is formed at the center of the liquid layer. This causes tension that is balanced with a centrifugal force exerted on the peripheral portion of the liquid layer to disappear. Furthermore, the rotational speed of the substrate is further increased while the gas is discharged. Thus, the liquid layer moves outward from the substrate.
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