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    Substrate processing method and substrate processing apparatus
    1.
    发明授权
    Substrate processing method and substrate processing apparatus 有权
    基板处理方法和基板处理装置

    公开(公告)号：US09059221B2

    公开(公告)日：2015-06-16

    申请号：US11846890

    申请日：2007-08-29

    申请人： Tomohiro Goto ,  Masakazu Sanada ,  Kazuhito Shigemori ,  Osamu Tamada ,  Shuichi Yasuda

    发明人： Tomohiro Goto ,  Masakazu Sanada ,  Kazuhito Shigemori ,  Osamu Tamada ,  Shuichi Yasuda

    IPC分类号： H01L21/02 ,  B08B3/04 ,  F26B5/08 ,  H01L21/67

    CPC分类号： B08B3/024 ,  F26B5/08 ,  H01L21/02057 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

    摘要： A method capable of eliminating occurrence of a development failure when a DI water discharge nozzle 20 is scanned to dry a substrate by spinning is provided. A substrate W is held in a horizontal posture by a spin chuck 10 and rotated about a vertical axis by a rotation motor 14, and when an outlet of the nozzle 20 is scanned from a position opposed to a center of the substrate W to a position opposed to a circumferential edge while a cleaning solution being discharged, immediately after the nozzle 20 has started to move, only one dried core is produced in the vicinity of the center of the substrate W, and thus production of not less than two dried cores in the vicinity of the center of the substrate W is prevented. The dried region is spread all over the surface of the substrate W.

    摘要翻译： 提供了当去除去离子水喷嘴20被扫描以通过纺丝干燥基板时能够消除显影破坏的发生的方法。 基板W由旋转卡盘10保持在水平姿态，并通过旋转马达14绕垂直轴旋转，并且当喷嘴20的出口从与基板W的中心相对的位置扫描到位置 在喷嘴20开始移动之后立即排出清洗液时，与圆周边缘相对，在基板W的中心附近仅产生一个干燥的芯，从而在基板W的中心生成不少于2个的干燥芯 防止了基板W的中心附近。 干燥的区域遍布衬底W的整个表面。

    SUBSTRATE PROCESSING APPARATUS
    3.
    发明申请
    SUBSTRATE PROCESSING APPARATUS 有权
    基板加工设备

    公开(公告)号：US20100239986A1

    公开(公告)日：2010-09-23

    申请号：US12813251

    申请日：2010-06-10

    申请人： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda

    发明人： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda

    IPC分类号： G03F7/16 ,  B05D3/02

    CPC分类号： G03F7/70991 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67178

    摘要： The transporting process from cleaning and drying processing of a substrate in a cleaning/drying processing unit in a cleaning/drying processing group to post-exposure bake (PEB) of the substrate in a thermal processing group for post-exposure bake in a cleaning/drying processing block is described below. First, after the substrate after exposure processing is subjected to the cleaning and drying processing in the cleaning/drying processing group, a sixth central robot takes out the substrate from the cleaning/drying processing group and carries that substrate into the thermal processing group for post-exposure bake in the cleaning/drying processing block.

    摘要翻译： 在清洁/干燥处理组中的清洁/干燥处理单元中的基板的清洁和干燥处理到在热处理组中的曝光后烘烤（PEB）的后处理组中的曝光后烘烤处理的传送过程， 干燥处理块如下所述。 首先，在清洗/干燥处理组中对曝光处理后的基板进行清洗干燥处理后，第六中央机器人从清洗/干燥处理组中取出基板，将该基板搬送到热处理组中 - 在清洁/干燥处理块中进行曝光烘烤。

    Substrate processing method
    5.
    发明授权
    Substrate processing method 有权
    基板加工方法

    公开(公告)号：US08540824B2

    公开(公告)日：2013-09-24

    申请号：US12813251

    申请日：2010-06-10

    申请人： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda

    发明人： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda

    IPC分类号： B08B3/00 ,  H01L21/31 ,  G03F7/00 ,  G03F1/00

    CPC分类号： G03F7/70991 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67178

    摘要： The transporting process from cleaning and drying processing of a substrate in a cleaning/drying processing unit in a cleaning/drying processing group to post-exposure bake (PEB) of the substrate in a thermal processing group for post-exposure bake in a cleaning/drying processing block is described below. First, after the substrate after exposure processing is subjected to the cleaning and drying processing in the cleaning/drying processing group, a sixth central robot takes out the substrate from the cleaning/drying processing group and carries that substrate into the thermal processing group for post-exposure bake in the cleaning/drying processing block.

    摘要翻译： 在清洁/干燥处理组中的清洁/干燥处理单元中的基板的清洁和干燥处理到在热处理组中的曝光后烘烤（PEB）的后处理组中的曝光后烘烤处理的传送过程， 干燥处理块如下所述。 首先，在清洗/干燥处理组中对曝光处理后的基板进行清洗干燥处理后，第六中央机器人从清洗/干燥处理组中取出基板，将该基板搬送到热处理组中 - 在清洁/干燥处理块中进行曝光烘烤。

    MULTI-SPEED SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    7.
    发明申请
    MULTI-SPEED SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
    多速基板加工设备和基板处理方法

    公开(公告)号：US20090071940A1

    公开(公告)日：2009-03-19

    申请号：US12208992

    申请日：2008-09-11

    申请人： Tadashi Miyagi ,  Masashi Kanaoka ,  Kazuhito Shigemori ,  Shuichi Yasuda ,  Masakazu Sanada

    发明人： Tadashi Miyagi ,  Masashi Kanaoka ,  Kazuhito Shigemori ,  Shuichi Yasuda ,  Masakazu Sanada

    IPC分类号： C23F1/00 ,  C23F1/08

    CPC分类号： H01L21/67034 ,  B05C11/08 ,  B05C13/02 ,  B05D3/0406 ,  G03F7/3028 ,  H01L21/67028 ,  H01L21/67051 ,  Y10S134/902

    摘要： After a development liquid on a substrate is washed away with a rinse liquid, the rotational speed of the substrate is reduced, so that a liquid layer of the rinse liquid is formed over a top surface of the substrate. Thereafter, the rotational speed of the substrate is increased. The increase in the rotational speed of the substrate causes a centrifugal force to be slightly greater than tension, thereby causing the liquid layer to be held on the substrate with the thickness thereof in its peripheral portion increased and the thickness thereof at the center thereof decreased. Then, gas is discharged toward the center of the liquid layer from a gas supply nozzle, so that a hole is formed at the center of the liquid layer. This causes tension that is balanced with a centrifugal force exerted on the peripheral portion of the liquid layer to disappear. Furthermore, the rotational speed of the substrate is further increased while the gas is discharged. Thus, the liquid layer moves outward from the substrate.

    摘要翻译： 在用冲洗液冲洗衬底上的显影液后，减小基片的旋转速度，从而在衬底的顶表面上形成漂洗液体的液体层。 此后，基板的旋转速度增加。 基板的旋转速度的增加使离心力略大于张力，从而使液体层保持在基板的周边部分的厚度增加，其中心部的厚度减小。 然后，气体从气体供给喷嘴向液体中心排出，从而在液体层的中心形成有孔。 这导致张力被平衡，施加在液体层的周边部分上的离心力消失。 此外，在排出气体的同时，基板的旋转速度进一步提高。 因此，液体层从基板向外移动。

    METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS
    8.
    发明申请
    METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS 审中-公开
    基板加工方法，基板加工系统及基板加工设备

    公开(公告)号：US20070253710A1

    公开(公告)日：2007-11-01

    申请号：US11740397

    申请日：2007-04-26

    申请人： Koji KANEYAMA ,  Kazuhito SHIGEMORI ,  Masashi KANAOKA ,  Tadashi MIYAGI ,  Shuichi YASUDA

    发明人： Koji KANEYAMA ,  Kazuhito SHIGEMORI ,  Masashi KANAOKA ,  Tadashi MIYAGI ,  Shuichi YASUDA

    IPC分类号： G03D5/00

    CPC分类号： G03F7/70925 ,  G03F7/70341 ,  G03F7/70533 ,  G03F7/7075 ,  G03F7/70916 ,  G03F7/70991

    摘要： In an exposure unit compatible with immersion exposure, a dummy substrate to be used for an alignment process for adjustment of an exposure position for a pattern image is transferred to a substrate processing apparatus for performing a resist coating process before exposure and a development process after exposure. In the substrate processing apparatus, the received dummy substrate is reversed and transferred to a back surface cleaning unit, to be subjected to a back surface cleaning process. After that, the dummy substrate is reversed again and transferred to a front surface cleaning unit, to be subjected to a front surface cleaning process. The dummy substrate after being cleaned is transferred back from the substrate processing apparatus to the exposure unit. Since the alignment process can be performed by using a clean dummy substrate in the exposure unit, it is possible to reduce contamination of mechanisms in the exposure unit, such as a substrate stage and the like.

    摘要翻译： 在与浸没曝光兼容的曝光单元中，将用于调整图案图像的曝光位置的对准处理的虚设基板转印到用于在曝光之前进行抗蚀剂涂布处理的基板处理装置和曝光后的显影处理 。 在基板处理装置中，将接收到的虚拟基板反转并转印到后表面清洁单元，以进行后表面清洁处理。 之后，将虚拟基板再次反转并转移到前表面清洁单元，以进行正面清洁处理。 清理后的虚设基板从基板处理装置返回到曝光单元。 由于可以通过在曝光单元中使用清洁的虚设基板进行取向处理，所以可以减少诸如基板台等的曝光单元中的机构的污染。

    METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS
    9.
    发明申请
    METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS 审中-公开
    基板加工方法，基板加工系统及基板加工设备

    公开(公告)号：US20070147832A1

    公开(公告)日：2007-06-28

    申请号：US11615513

    申请日：2006-12-22

    申请人： Kazuhito Shigemori ,  Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Shuichi Yasuda

    发明人： Kazuhito Shigemori ,  Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Shuichi Yasuda

    IPC分类号： G03D5/00

    CPC分类号： H01L21/67178 ,  H01L21/67173 ,  H01L21/67225 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67748

    摘要： Immediately before or immediately after an alignment process for adjusting an exposure position of a pattern image in an exposure unit compatible with immersion exposure, a dummy substrate for use in the alignment process is transported from the exposure unit to a substrate processing apparatus. In the substrate processing apparatus, a cleaning processing unit cleans and dries the received dummy substrate. The cleaned dummy substrate is transported from the substrate processing apparatus back to the exposure unit. The use of the clean dummy substrate for the execution of the alignment process in the exposure unit reduces contamination of mechanisms within the exposure unit, such as a substrate stage. When the dummy substrate is water-repellent, the cleaning in the substrate processing apparatus restores the water repellency of the dummy substrate.

    摘要翻译： 在用于调整与浸没曝光相容的曝光单元中的图案图像的曝光位置的对准处理之前或之后，将用于对准处理的伪基板从曝光单元传送到基板处理装置。 在基板处理装置中，清洗处理部对所接收的虚设基板进行清洗干燥。 清洁的虚设基板从基板处理装置输送回曝光单元。 用于执行曝光单元中的对准处理的干净的虚设基板的使用减少了曝光单元内诸如基板台之间的机构的污染。 当虚设基板为憎水性时，基板处理装置的清洗恢复虚设基板的防水性。