发明申请
- 专利标题： STRUCTURE TO SHARE INTERNALLY GENERATED VOLTAGES BETWEEN CHIPS IN MCP
- 专利标题（中）： 在MCP中分配内部电压之间的结构
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申请号： US11860977申请日： 2007-09-25
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公开(公告)号： US20090080279A1公开(公告)日： 2009-03-26
- 发明人: JUNG PILL KIM , Jong Hoon Oh , Oliver Kiehl , Josef Schnell , Klaus Hummler , Wayne Frederick Ellis , Octavian Beldiman , Lee Ward Collins
- 申请人： JUNG PILL KIM , Jong Hoon Oh , Oliver Kiehl , Josef Schnell , Klaus Hummler , Wayne Frederick Ellis , Octavian Beldiman , Lee Ward Collins
- 主分类号： G11C5/14
- IPC分类号： G11C5/14 ; H01L23/538
摘要：
Embodiments of the invention generally provide an apparatus and technique for sharing an internally generated voltage between devices of a multi-chip package (MCP). The internally generated voltage may be shared via a conductive structure that electrically couples the devices and carries the internally generated voltage.