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1.
公开(公告)号:US20090080279A1
公开(公告)日:2009-03-26
申请号:US11860977
申请日:2007-09-25
申请人: JUNG PILL KIM , Jong Hoon Oh , Oliver Kiehl , Josef Schnell , Klaus Hummler , Wayne Frederick Ellis , Octavian Beldiman , Lee Ward Collins
发明人: JUNG PILL KIM , Jong Hoon Oh , Oliver Kiehl , Josef Schnell , Klaus Hummler , Wayne Frederick Ellis , Octavian Beldiman , Lee Ward Collins
IPC分类号: G11C5/14 , H01L23/538
CPC分类号: H01L23/5286 , H01L23/3128 , H01L23/50 , H01L25/0657 , H01L2924/0002 , H01L2924/15311 , H01L2924/00
摘要: Embodiments of the invention generally provide an apparatus and technique for sharing an internally generated voltage between devices of a multi-chip package (MCP). The internally generated voltage may be shared via a conductive structure that electrically couples the devices and carries the internally generated voltage.
摘要翻译: 本发明的实施例通常提供用于在多芯片封装(MCP)的器件之间共享内部产生的电压的装置和技术。 内部产生的电压可以通过电耦合器件并承载内部产生的电压的导电结构来共享。