Invention Application
- Patent Title: METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE COMPRISING SURFACE-MOUNTABLE FLAT EXTERNAL CONTACTS
- Patent Title (中): 用于生产包含表面平面外部接触的功率半导体模块的方法
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Application No.: US11867329Application Date: 2007-10-04
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Publication No.: US20090093090A1Publication Date: 2009-04-09
- Inventor: Henrik Ewe , Stefan Landau , Klaus Schiess , Robert Bergmann , Alvin Wee Beng Tatt , Soon Lock Goh , Joachim Mahler , Boris Plikat , Reimund Engl
- Applicant: Henrik Ewe , Stefan Landau , Klaus Schiess , Robert Bergmann , Alvin Wee Beng Tatt , Soon Lock Goh , Joachim Mahler , Boris Plikat , Reimund Engl
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L21/56
- IPC: H01L21/56
Abstract:
A method for producing a power semiconductor module having surface mountable flat external contact areas is disclosed. At least one power semiconductor chip is fixed by its rear side on a drain external contact. An insulation layer covers the top side over the side edges of the semiconductor chip as far as the inner housing plane was a leaving free the source and gate contact areas on the top side of the semiconductor chip and also was partly leaving free the top sides of the corresponding external contacts.
Public/Granted literature
- US07955901B2 Method for producing a power semiconductor module comprising surface-mountable flat external contacts Public/Granted day:2011-06-07
Information query
IPC分类:
