发明申请
US20090115978A1 METHOD FOR TREATING SUBSTRATE, METHOD FOR CONVEYING SUBSTRATE, AND APPARATUS FOR CONVEYING SUBSTRATE
失效
用于处理基板的方法，用于输送基板的方法和用于输送基板的装置
- 专利标题： METHOD FOR TREATING SUBSTRATE, METHOD FOR CONVEYING SUBSTRATE, AND APPARATUS FOR CONVEYING SUBSTRATE
- 专利标题（中）： 用于处理基板的方法，用于输送基板的方法和用于输送基板的装置
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申请号： US12261596申请日： 2008-10-30
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公开(公告)号： US20090115978A1公开(公告)日： 2009-05-07
- 发明人: Kentaro MATSUNAGA , Daisuke Kawamura , Seiro Miyoshi , Eishi Shiobara
- 申请人： Kentaro MATSUNAGA , Daisuke Kawamura , Seiro Miyoshi , Eishi Shiobara
- 优先权： JP2007-282374 20071030
- 主分类号： G03F7/38
- IPC分类号： G03F7/38
摘要：
A method for treating a substrate before exposing the substrate to which a resist is applied, includes, rinsing the substrate to which a resist is applied, and holding the rinsed substrate in an atmosphere. The atmosphere substantially contains no moisture until conveying the substrate to an exposure apparatus.
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