发明申请
- 专利标题： Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method
- 专利标题（中）： 修整抛光垫的方法和装置，轮廓测量方法，基底抛光装置和基底抛光方法
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申请号： US12292685申请日： 2008-11-24
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公开(公告)号： US20090137190A1公开(公告)日： 2009-05-28
- 发明人: Tetsuji Togawa , Keisuke Namiki , Satoru Yamaki
- 申请人： Tetsuji Togawa , Keisuke Namiki , Satoru Yamaki
- 专利权人： EBARA CORPORATION
- 当前专利权人： EBARA CORPORATION
- 优先权： JP2007-307458 20071128; JP2008-288107 20081110
- 主分类号： B24B49/00
- IPC分类号： B24B49/00 ; B24B49/10 ; B24B53/02 ; B24B7/20
摘要：
The present invention provides a dressing method of dressing a polishing pad used in a polishing apparatus for polishing a substrate. This method includes repetitively moving the dresser on an upper surface of the polishing pad in a radial direction of the polishing pad so as to perform a dressing process on the polishing pad, during the dressing process, measuring a height of an upper surface of the polishing pad at a predetermined point in one of plural zones on the polishing surface, and repeating the repetitive moving of the dresser and the measuring of the height of the upper surface of the polishing pad so as to measure the height of the upper surface of the polishing pad in all of the plural zones.
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