利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

25 条记录 (耗时 0.019 秒)

    Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method
    1.
    发明授权
    Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method 有权
    修整抛光垫的方法和装置，轮廓测量方法，基底抛光装置和基底抛光方法

    公开(公告)号：US08870625B2

    公开(公告)日：2014-10-28

    申请号：US12292685

    申请日：2008-11-24

    申请人： Tetsuji Togawa ,  Keisuke Namiki ,  Satoru Yamaki

    发明人： Tetsuji Togawa ,  Keisuke Namiki ,  Satoru Yamaki

    IPC分类号： B24B49/00 ,  B24B53/02 ,  B24B37/013 ,  B24B49/10 ,  B24B53/017 ,  B24B49/16

    CPC分类号： B24B53/017 ,  B24B37/013 ,  B24B49/10 ,  B24B49/16

    摘要： A dressing method is used to dress a polishing pad of a polishing apparatus for polishing a substrate. This method includes repetitively moving the dresser on an upper surface of the polishing pad in a radial direction of the polishing pad so as to perform a dressing process on the polishing pad, during the dressing process, measuring a height of an upper surface of the polishing pad at a predetermined point in one of plural zones on the polishing surface, and repeating the repetitive moving of the dresser and the measuring of the height of the upper surface of the polishing pad so as to measure the height of the upper surface of the polishing pad in all of the plural zones.

    摘要翻译： 使用修整方法来打磨抛光装置的抛光垫以抛光基底。 该方法包括在抛光垫的径向上重复地将修整器沿抛光垫的径向重复地移动到抛光垫的上表面上，以便在修整过程中对抛光垫进行修整处理，测量抛光上表面的高度 在抛光表面上的多个区域中的一个区域中的预定点处的垫，并且重复修整器的重复移动和测量抛光垫的上表面的高度，以便测量抛光上表面的高度 在所有多个区域中的垫。

    Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method
    3.
    发明申请
    Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method 有权
    修整抛光垫的方法和装置，轮廓测量方法，基底抛光装置和基底抛光方法

    公开(公告)号：US20090137190A1

    公开(公告)日：2009-05-28

    申请号：US12292685

    申请日：2008-11-24

    申请人： Tetsuji Togawa ,  Keisuke Namiki ,  Satoru Yamaki

    发明人： Tetsuji Togawa ,  Keisuke Namiki ,  Satoru Yamaki

    IPC分类号： B24B49/00 ,  B24B49/10 ,  B24B53/02 ,  B24B7/20

    CPC分类号： B24B53/017 ,  B24B37/013 ,  B24B49/10 ,  B24B49/16

    摘要： The present invention provides a dressing method of dressing a polishing pad used in a polishing apparatus for polishing a substrate. This method includes repetitively moving the dresser on an upper surface of the polishing pad in a radial direction of the polishing pad so as to perform a dressing process on the polishing pad, during the dressing process, measuring a height of an upper surface of the polishing pad at a predetermined point in one of plural zones on the polishing surface, and repeating the repetitive moving of the dresser and the measuring of the height of the upper surface of the polishing pad so as to measure the height of the upper surface of the polishing pad in all of the plural zones.

    摘要翻译： 本发明提供了一种修整抛光装置中用于抛光基板的抛光垫的修整方法。 该方法包括在抛光垫的径向上重复地将修整器沿抛光垫的径向重复地移动到抛光垫的上表面上，以便在修整过程中对抛光垫进行修整处理，测量抛光上表面的高度 在抛光表面上的多个区域中的一个区域中的预定点处的垫，并且重复修整器的重复移动和测量抛光垫的上表面的高度，以便测量抛光上表面的高度 在所有多个区域中的垫。

    Substrate polishing machine
    4.
    发明授权
    Substrate polishing machine 失效
    基材抛光机

    公开(公告)号：US07156725B2

    公开(公告)日：2007-01-02

    申请号：US10481591

    申请日：2002-07-10

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B29/00 ,  B24B5/00

    CPC分类号： B24B37/30 ,  B24B37/32

    摘要： There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface.

    摘要翻译： 提供了一种衬底抛光机，其包括抛光表面和用于保持衬底并使其与抛光表面接触的衬底载体。 基板载体包括载体主体，用于保持待抛光基板的表面朝向抛光表面的基板的基板保持构件。 衬底保持构件以使得衬底保持构件能够朝向和远离抛光表面移动的方式安装在载体主体上。 基板研磨机还包括基板保持部件定位装置，该基板保持部件定位装置设置在基板保持部件的与保持基板相同的一侧。 衬底保持构件定位装置具有限定腔室的柔性构件，并且在引入不可压缩流体时沿朝向抛光表面的方向膨胀。

    Substrate holding apparatus
    5.
    发明授权
    Substrate holding apparatus 有权
    基板保持装置

    公开(公告)号：US07083507B2

    公开(公告)日：2006-08-01

    申请号：US11028629

    申请日：2005-01-05

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B7/22

    CPC分类号： B24B37/30 ,  B24B41/061

    摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

    摘要翻译： 本发明涉及一种用于保持待抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于与基板接触的弹性垫，以及用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于与弹性垫接触的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

    Substrate holding apparatus
    6.
    发明授权
    Substrate holding apparatus 有权
    基板保持装置

    公开(公告)号：US07850509B2

    公开(公告)日：2010-12-14

    申请号：US12285936

    申请日：2008-10-16

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B7/22

    CPC分类号： B24B37/30 ,  B24B41/061

    摘要： The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

    摘要翻译： 本发明涉及一种用于将基板保持并压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于接触基板的弹性垫和用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于接触弹性垫的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

    Substrate holding apparatus
    9.
    发明申请
    Substrate holding apparatus 有权
    基板保持装置

    公开(公告)号：US20050118935A1

    公开(公告)日：2005-06-02

    申请号：US11028629

    申请日：2005-01-05

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B37/005 ,  B24B37/04 ,  B24B37/30 ,  B24B41/06 ,  H01L21/304 ,  B24B1/00

    CPC分类号： B24B37/30 ,  B24B41/061

    摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

    摘要翻译： 本发明涉及一种用于保持待抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于与基板接触的弹性垫，以及用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于与弹性垫接触的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。