发明申请
- 专利标题： Substrate processing apparatus
- 专利标题（中）： 基板加工装置
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申请号： US12292947申请日： 2008-12-01
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公开(公告)号： US20090139656A1公开(公告)日： 2009-06-04
- 发明人: Koukichi Hiroshiro , Hideyuki Yamamoto , Kazuhiro Takeshita , Takayuki Toshima
- 申请人： Koukichi Hiroshiro , Hideyuki Yamamoto , Kazuhiro Takeshita , Takayuki Toshima
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 优先权： JP2007-314048 20071204
- 主分类号： H01L21/306
- IPC分类号： H01L21/306
摘要：
The present invention provides a substrate processing apparatus for processing substrates by immersing the substrates in a processing liquid. This substrate processing apparatus includes a processing tank having a pair of side walls arranged to be opposed to each other; and a pair of processing-liquid supply mechanisms provided respectively corresponding to the pair of side walls. The pair of processing-liquid supply mechanisms are respectively configured for supplying the processing liquid toward a central portion of the processing tank in the width direction connecting the pair of side walls, thereby to create a rising flow of the processing liquid in a central area in the width direction of the processing tank. Each inner wall face of the pair of side walls includes a main body, a projecting portion located above the main body, and a discharge guide portion located uppermost and providing a discharge port configured for allowing the processing liquid to overflow. The discharge guide portion is inclined upward, opposite to the central portion in the width direction. The projecting portion includes an inner end portion located nearer to the central portion in the width direction, as compared with the main body and discharge guide portion.
公开/授权文献
- US07998306B2 Substrate processing apparatus 公开/授权日：2011-08-16
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