发明申请
- 专利标题: Plating apparatus and plating method
- 专利标题(中): 电镀装置及电镀方法
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申请号: US12314143申请日: 2008-12-04
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公开(公告)号: US20090139871A1公开(公告)日: 2009-06-04
- 发明人: Nobutoshi Saito , Jumpei Fujikata , Tadaaki Yamamoto , Kenji Kamimura
- 申请人: Nobutoshi Saito , Jumpei Fujikata , Tadaaki Yamamoto , Kenji Kamimura
- 优先权: JP2007-313730 20071204; JP2008-292174 20081114
- 主分类号: C25D21/10
- IPC分类号: C25D21/10 ; C25D17/00
摘要:
A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.
公开/授权文献
- US08177944B2 Plating apparatus and plating method 公开/授权日:2012-05-15