Plating apparatus and plating method

    公开(公告)号:US08486234B2

    公开(公告)日:2013-07-16

    申请号:US13443149

    申请日:2012-04-10

    IPC分类号: C25D17/02 C25D17/04 C25D5/00

    摘要: A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.

    Plating apparatus and plating method
    2.
    发明授权
    Plating apparatus and plating method 有权
    电镀装置及电镀方法

    公开(公告)号:US08177944B2

    公开(公告)日:2012-05-15

    申请号:US12314143

    申请日:2008-12-04

    摘要: A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.

    摘要翻译: 电镀装置可以形成具有平坦顶部的凸块,或者即使当在高电流密度条件下进行电镀对象(基板)的镀覆时,也可以形成具有良好的面内均匀性的金属膜。 电镀装置包括用于保持电镀液的电镀槽; 将阳极浸入镀槽中的镀液中; 用于保持电镀对象并将电镀对象放置在与阳极相对的位置处的保持器; 设置在所述阳极和由所述保持器保持的所述电镀对象之间的平行于所述电镀对象平移的电镀液,以搅拌所述电镀液; 以及控制部分,用于控制驱动桨叶的桨驱动部分。 控制部分控制桨驱动部分,使得桨以平均绝对值为70cm / sec至100cm / sec的速度移动。

    Plating apparatus and plating method
    3.
    发明申请
    Plating apparatus and plating method 有权
    电镀装置及电镀方法

    公开(公告)号:US20090139871A1

    公开(公告)日:2009-06-04

    申请号:US12314143

    申请日:2008-12-04

    IPC分类号: C25D21/10 C25D17/00

    摘要: A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.

    摘要翻译: 电镀装置可以形成具有平坦顶部的凸块,或者即使当在高电流密度条件下进行电镀对象(基板)的镀覆时,也可以形成具有良好的面内均匀性的金属膜。 电镀装置包括用于保持电镀液的电镀槽; 将阳极浸入镀槽中的镀液中; 用于保持电镀对象并将电镀对象放置在与阳极相对的位置处的保持器; 设置在所述阳极和由所述保持器保持的所述电镀对象之间的平行于所述电镀对象平移的电镀液,以搅拌所述电镀液; 以及控制部分,用于控制驱动桨叶的桨驱动部分。 控制部分控制桨驱动部分,使得桨以平均绝对值为70cm / sec至100cm / sec的速度移动。

    Method of regenerating zeolite to remove acetone and water
    4.
    发明授权
    Method of regenerating zeolite to remove acetone and water 失效
    再生沸石以除去丙酮和水的方法

    公开(公告)号:US4717697A

    公开(公告)日:1988-01-05

    申请号:US883120

    申请日:1986-07-08

    摘要: A method of regenerating hydrous zeolite which contains acetone as well as water after having been used to dehydrate hydrous acetone of the invention which comprises: placing the hydrous zeolite in a closed system in which a heated inert gas is circulated at a pressure more than atmospheric pressures to bring the inert gas into contact with the hydrous zeolite to remove the acetone and water from the zeolite, and condensing the acetone and water in the closed system and removes them from the closed system.The method is in particular useful for regenerating hydrous zeolite which has been used to dehydrate hydrous acetone resulting from the reaction of L-sorbose with acetone to produce diacetone-L-sorbose, and which thus contains acetone as well as about 1000-4000 ppm of water therein.

    摘要翻译: 在本发明的含水丙酮脱水后,再生含有丙酮以及水的含水沸石的方法,该方法包括:将含水沸石置于密闭系统中,其中加热的惰性气体在高于大气压的压力下循环 使惰性气体与含水沸石接触以从沸石中除去丙酮和水,并将封闭系统中的丙酮和水冷凝并将其从封闭系统中除去。 该方法特别可用于再生含水沸石,其用于使由L-山梨糖与丙酮反应产生的含水丙酮脱水以产生双丙酮-L-山梨糖,由此含有丙酮以及约1000-4000ppm的 水中。

    PLATING APPARATUS AND PLATING METHOD
    5.
    发明申请
    PLATING APPARATUS AND PLATING METHOD 有权
    电镀设备和电镀方法

    公开(公告)号:US20120193220A1

    公开(公告)日:2012-08-02

    申请号:US13443149

    申请日:2012-04-10

    IPC分类号: C25B15/02 C25B9/08

    摘要: A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.

    摘要翻译: 电镀装置可以形成具有平坦顶部的凸块,或者即使当在高电流密度条件下进行电镀对象(基板)的镀覆时,也可以形成具有良好的面内均匀性的金属膜。 电镀装置包括用于保持电镀液的电镀槽; 将阳极浸入镀槽中的镀液中; 用于保持电镀对象并将电镀对象放置在与阳极相对的位置处的保持器; 设置在所述阳极和由所述保持器保持的所述电镀对象之间的平行于所述电镀对象平移的电镀液,以搅拌所述电镀液; 以及控制部分,用于控制驱动桨叶的桨驱动部分。 控制部分控制桨驱动部分,使得桨以平均绝对值为70cm / sec至100cm / sec的速度移动。