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公开(公告)号：US08486234B2
公开(公告)日：2013-07-16
申请号：US13443149
申请日：2012-04-10
CPC分类号： C25D21/10 , C25D17/001 , C25D17/007 , C25D17/008 , C25D21/12
摘要： A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.
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公开(公告)号：US08177944B2
公开(公告)日：2012-05-15
申请号：US12314143
申请日：2008-12-04
CPC分类号： C25D21/10 , C25D17/001 , C25D17/007 , C25D17/008 , C25D21/12
摘要： A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.
摘要翻译： 电镀装置可以形成具有平坦顶部的凸块，或者即使当在高电流密度条件下进行电镀对象（基板）的镀覆时，也可以形成具有良好的面内均匀性的金属膜。 电镀装置包括用于保持电镀液的电镀槽; 将阳极浸入镀槽中的镀液中; 用于保持电镀对象并将电镀对象放置在与阳极相对的位置处的保持器; 设置在所述阳极和由所述保持器保持的所述电镀对象之间的平行于所述电镀对象平移的电镀液，以搅拌所述电镀液; 以及控制部分，用于控制驱动桨叶的桨驱动部分。 控制部分控制桨驱动部分，使得桨以平均绝对值为70cm / sec至100cm / sec的速度移动。
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公开(公告)号：US20090139871A1
公开(公告)日：2009-06-04
申请号：US12314143
申请日：2008-12-04
CPC分类号： C25D21/10 , C25D17/001 , C25D17/007 , C25D17/008 , C25D21/12
摘要： A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.
摘要翻译： 电镀装置可以形成具有平坦顶部的凸块，或者即使当在高电流密度条件下进行电镀对象（基板）的镀覆时，也可以形成具有良好的面内均匀性的金属膜。 电镀装置包括用于保持电镀液的电镀槽; 将阳极浸入镀槽中的镀液中; 用于保持电镀对象并将电镀对象放置在与阳极相对的位置处的保持器; 设置在所述阳极和由所述保持器保持的所述电镀对象之间的平行于所述电镀对象平移的电镀液，以搅拌所述电镀液; 以及控制部分，用于控制驱动桨叶的桨驱动部分。 控制部分控制桨驱动部分，使得桨以平均绝对值为70cm / sec至100cm / sec的速度移动。
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公开(公告)号：US20120160696A1
公开(公告)日：2012-06-28
申请号：US13336202
申请日：2011-12-23
申请人： Yuji ARAKI , Nobutoshi Saito , Jumpei Fujikata
发明人： Yuji ARAKI , Nobutoshi Saito , Jumpei Fujikata
CPC分类号： C25D5/18 , C25D11/024 , H01L21/2885 , H01L21/76898
摘要： A substrate with a through-hole is immersed in a plating solution in a plating tank. A pair of anodes are disposed in the plating solution in the plating tank in facing relation to face and reverse sides, respectively, of the substrate in the plating solution. A plurality of plating processes are performed on the face and reverse sides by supplying pulsed currents respectively between the face side of the substrate and one of the anodes which faces the face side of the substrate, and between the reverse side of the substrate and the other anode which faces the reverse side of the substrate. A reverse electrolyzing process is performed on the face and reverse sides between adjacent plating processes by supplying currents in an opposite direction to the pulsed currents respectively between the face side of the substrate and one of the anodes, and between the reverse side of the substrate and the other anode.
摘要翻译： 将具有通孔的基板浸渍在电镀槽中的电镀液中。 在镀液中的电镀溶液中分别以电镀液中的基板的正反面设置一对阳极。 通过分别在基板的表面侧和面向基板的正面侧的一个阳极之间以及在基板的相反侧和另一个之间提供脉冲电流来在正面和反面上进行多个电镀处理 面向基板背面的阳极。 在相邻电镀工艺之间的正面和反面上进行反向电解处理，该方法是在相对于脉冲电流的相反方向上提供电流，该脉冲电流分别在衬底的表面侧和一个阳极之间，以及在衬底的相反侧和 另一个阳极。
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公开(公告)号：US20090311429A1
公开(公告)日：2009-12-17
申请号：US12461613
申请日：2009-08-18
申请人： Fumio Kuriyama , Rei Kiumi , Nobutoshi Saito , Takashi Takemura , Masaaki Kimura , Sachiko Takeda , Yugang Guo
发明人： Fumio Kuriyama , Rei Kiumi , Nobutoshi Saito , Takashi Takemura , Masaaki Kimura , Sachiko Takeda , Yugang Guo
IPC分类号： B05D3/10
CPC分类号： C23C18/182 , B05B13/0228 , C23C18/1632 , C23C18/1689 , C23C18/18 , C23C18/1824 , C23C18/1837 , C25D5/34 , C25D5/48 , C25D7/123 , C25D17/001 , H01L21/288 , H05K3/241 , H05K3/244
摘要： A plating apparatus has a steam treatment chamber configured to perform a steam treatment using steam on a surface of a substrate, and a plating chamber configured to plate the surface of the substrate subjected to the steam treatment. The plating apparatus also has an acid treatment chamber configured to bring the surface of the substrate subjected to the steam treatment into contact with an acid liquid. The plating apparatus includes a frame housing the steam treatment chamber, the acid treatment chamber, and the plating chamber.
摘要翻译： 电镀装置具有蒸汽处理室，其被配置为在基板的表面上进行使用蒸汽的蒸汽处理，以及电镀室，被配置为对经受蒸汽处理的基板的表面进行平板化。 电镀装置还具有配置成使经受蒸汽处理的基板的表面与酸性液体接触的酸处理室。 电镀装置包括容纳蒸汽处理室，酸处理室和电镀室的框架。
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公开(公告)号：US20070117365A1
公开(公告)日：2007-05-24
申请号：US10571751
申请日：2004-09-29
申请人： Fumio Kuriyama , Rei Kiumi , Nobutoshi Saito , Takashi Takemura , Masaaki Kimura , Sachiko Takeda , Yugang Guo
发明人： Fumio Kuriyama , Rei Kiumi , Nobutoshi Saito , Takashi Takemura , Masaaki Kimura , Sachiko Takeda , Yugang Guo
IPC分类号： H01L21/44
CPC分类号： C23C18/182 , B05B13/0228 , C23C18/1632 , C23C18/1689 , C23C18/18 , C23C18/1824 , C23C18/1837 , C25D5/34 , C25D5/48 , C25D7/123 , C25D17/001 , H01L21/288 , H05K3/241 , H05K3/244
摘要： A plating method comprising applying an ultraviolet ray to a surface of a substrate or exposing a surface of a substrate to an ozone gas or bringing a surface to a substrate into contact with ozone water or bringing a surface of a substrate into contact with electrolytic ionized water or performing a team treatment using steam on a surface of a substrate, and plating the surface of the substrate after said applying, exposing, bringing or performing process. A plating method comprising performing a team treatment using steam on a surface of a substrate, and performing a wet process on the surface of the substrate of a substrate with an acidic plating solution, cleaning the surface of the substrate with pure water and cleaning the surface of the substrate with an alkalescent aqueous solution. A plating apparatus adapted to perform at least one of said methods.
摘要翻译： 一种电镀方法，其包括将紫外线施加到基板的表面或将基板的表面暴露于臭氧气体或使表面与基底接触的方式与臭氧水接触或使基板的表面与电解电离水接触 或者使用蒸镀在基板的表面上进行团队处理，以及在施加，曝光，进行或执行处理之后对基板的表面进行电镀。 一种电镀方法，包括使用蒸镀在基材表面进行团队处理，并用酸性电镀液对基板表面进行湿法处理，用纯水清洗基板的表面并清洗表面 的碱性水溶液。 适于执行所述方法中的至少一种的电镀装置。
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公开(公告)号：US07118664B2
公开(公告)日：2006-10-10
申请号：US10779708
申请日：2004-02-18
IPC分类号： C25D21/00
CPC分类号： C23C18/1834 , C23C18/1605 , C25D5/003 , C25D17/001 , C25D21/00 , C25D21/04 , H05K3/187 , H05K3/422 , H05K3/423
摘要： The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.
摘要翻译： 本发明提供一种电镀方法和装置，其能够将电镀液引入形成于基板中的细孔和孔，而无需向电镀液中添加表面活性剂，能够形成高品质的镀膜 没有缺陷或遗漏。 使用电镀液对物体进行电解或无电镀的电镀方法包括：在溶液中溶解气体脱气后进行电镀操作; 和/或在预处理溶液中的溶解气体脱气之后使用预处理溶液进行预处理操作，然后进行电镀操作。
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公开(公告)号：US08317993B2
公开(公告)日：2012-11-27
申请号：US12461613
申请日：2009-08-18
申请人： Fumio Kuriyama , Rei Kiumi , Nobutoshi Saito , Takashi Takemura , Masaaki Kimura , Sachiko Takeda , Yugang Guo
发明人： Fumio Kuriyama , Rei Kiumi , Nobutoshi Saito , Takashi Takemura , Masaaki Kimura , Sachiko Takeda , Yugang Guo
CPC分类号： C23C18/182 , B05B13/0228 , C23C18/1632 , C23C18/1689 , C23C18/18 , C23C18/1824 , C23C18/1837 , C25D5/34 , C25D5/48 , C25D7/123 , C25D17/001 , H01L21/288 , H05K3/241 , H05K3/244
摘要： A plating apparatus has a steam treatment chamber configured to perform a steam treatment using steam on a surface of a substrate, and a plating chamber configured to plate the surface of the substrate subjected to the steam treatment. The plating apparatus also has an acid treatment chamber configured to bring the surface of the substrate subjected to the steam treatment into contact with an acid liquid. The plating apparatus includes a frame housing the steam treatment chamber, the acid treatment chamber, and the plating chamber.
摘要翻译： 电镀装置具有蒸汽处理室，其被配置为在基板的表面上进行使用蒸汽的蒸汽处理，以及电镀室，被配置为对经受蒸汽处理的基板的表面进行平板化。 电镀装置还具有配置成使经受蒸汽处理的基板的表面与酸性液体接触的酸处理室。 电镀装置包括容纳蒸汽处理室，酸处理室和电镀室的框架。
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公开(公告)号：US20090301395A1
公开(公告)日：2009-12-10
申请号：US12543832
申请日：2009-08-19
申请人： Masahiko SEKIMOTO , Yasuhiko Endo , Stephen Strausser , Takashi Takemura , Nobutoshi Saito , Fumio Kuriyama , Junichiro Yoshioka , Kuniaki Horie , Yoshio Minami , Kenji Kamoda
发明人： Masahiko SEKIMOTO , Yasuhiko Endo , Stephen Strausser , Takashi Takemura , Nobutoshi Saito , Fumio Kuriyama , Junichiro Yoshioka , Kuniaki Horie , Yoshio Minami , Kenji Kamoda
IPC分类号： B05C13/02
CPC分类号： C25D5/022 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67173 , H01L21/6723 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2224/05647 , H01L2924/00014
摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
摘要翻译： 电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的籽晶层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理， 被配置为在灰化过程之后向基板的表面提供亲水性。 电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。 电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504） 种子层形成在基底上。
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公开(公告)号：US06716332B1
公开(公告)日：2004-04-06
申请号：US09582919
申请日：2000-07-07
IPC分类号： C25D2100
CPC分类号： C23C18/1834 , C23C18/1605 , C25D5/003 , C25D17/001 , C25D21/00 , C25D21/04 , H05K3/187 , H05K3/422 , H05K3/423
摘要： The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.
摘要翻译： 本发明提供一种电镀方法和装置，其能够将电镀液引入形成于基板中的细孔和孔，而无需向电镀液中添加表面活性剂，能够形成高品质的镀膜 没有缺陷或遗漏。 使用电镀液对物体进行电解或无电镀的电镀方法包括：在溶液中溶解气体脱气后进行电镀操作; 和/或在预处理溶液中的溶解气体脱气之后使用预处理溶液进行预处理操作，然后进行电镀操作。
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