发明申请
- 专利标题： MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS
- 专利标题（中）： 改进无铅焊料合金组合物，以改善硅装置中的层间介电分层和焊接接头中的电阻率
-
申请号： US12254768申请日： 2008-10-20
-
公开(公告)号： US20090197103A1公开(公告)日： 2009-08-06
- 发明人: Da-Yuan Shih , Donald W. Henderson , Sung K. Kang , Minhua Lu , Jae-Woong Nah , Kamalesh Srivastava
- 申请人： Da-Yuan Shih , Donald W. Henderson , Sung K. Kang , Minhua Lu , Jae-Woong Nah , Kamalesh Srivastava
- 主分类号： B32B15/04
- IPC分类号： B32B15/04 ; B23K1/20 ; C22C13/00
摘要：
A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead free solder selected from the group comprising Sn—Ag—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 to 2.0% by weight Sb or Bi, and 0.5 to 3.0% Ag. Formation of voids at an interface between the solder and the solder capture pad is suppressed, by including Zn. Interlayer dielectric delamination is suppressed, and electromigration characteristics are greatly improved. Methods for forming solder joints using the solders.
信息查询
