发明申请
US20090229629A1 Stripper For Copper/Low k BEOL Clean 审中-公开
铜/低k剥离器BEOL清洁

Stripper For Copper/Low k BEOL Clean
摘要:
The present invention is a chemical stripper formulation for removing photoresist and the residue of etching and ashing of electronic device substrates, comprising: deionized water, acetic acid, polyethylene glycol, dipropylene glycol monomethyl ether and ammonium fluoride. The present invention is also a process for removing photoresist and the residue of etching and ashing of electronic device substrates by contacting the substrate with a formulation, comprising: deionized water, acetic acid, polyethylene glycol, dipropylene glycol monomethyl ether and ammonium fluoride.
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