发明申请
US20090244864A1 Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof 审中-公开
用于电容器嵌入式印刷电路板的基板,电容器嵌入式印刷电路板及其制造方法

Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof
摘要:
Disclosed are a substrate for a capacitor-embedded printed circuit board, a capacitor-embedded printed circuit board, and a manufacturing method thereof. The capacitor-embedded printed circuit board can include a core board, an insulation resin layer, which is stacked on the core board, a first electrode and a first circuit pattern, which are buried in the insulation resin layer, a dielectric layer, which is stacked on a surface of the insulation resin layer, a first adhesive resin layer, which is stacked on the dielectric layer, and a second electrode and a second circuit pattern, which are formed on a surface of the first adhesive resin layer to correspond with the first electrode. With the present invention, the manufacturing process can be simplified and the reliability of products can be improved by reducing the variation of the capacitor (C).
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