发明申请
US20090244864A1 Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof
审中-公开
用于电容器嵌入式印刷电路板的基板,电容器嵌入式印刷电路板及其制造方法
- 专利标题: Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof
- 专利标题(中): 用于电容器嵌入式印刷电路板的基板,电容器嵌入式印刷电路板及其制造方法
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申请号: US12320794申请日: 2009-02-04
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公开(公告)号: US20090244864A1公开(公告)日: 2009-10-01
- 发明人: Woon-Chun Kim , Sung Yi , Hwa-Sun Park , Sang-Chul Lee , Jong-Woo Han , Young-Do Kweon
- 申请人: Woon-Chun Kim , Sung Yi , Hwa-Sun Park , Sang-Chul Lee , Jong-Woo Han , Young-Do Kweon
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2008-0027551 20080325
- 主分类号: H05K1/18
- IPC分类号: H05K1/18 ; B32B7/00 ; B32B37/02
摘要:
Disclosed are a substrate for a capacitor-embedded printed circuit board, a capacitor-embedded printed circuit board, and a manufacturing method thereof. The capacitor-embedded printed circuit board can include a core board, an insulation resin layer, which is stacked on the core board, a first electrode and a first circuit pattern, which are buried in the insulation resin layer, a dielectric layer, which is stacked on a surface of the insulation resin layer, a first adhesive resin layer, which is stacked on the dielectric layer, and a second electrode and a second circuit pattern, which are formed on a surface of the first adhesive resin layer to correspond with the first electrode. With the present invention, the manufacturing process can be simplified and the reliability of products can be improved by reducing the variation of the capacitor (C).