公开(公告)号：US20090244864A1

公开(公告)日：2009-10-01

申请号：US12320794

申请日：2009-02-04

申请人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Sang-Chul Lee ,  Jong-Woo Han ,  Young-Do Kweon

发明人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Sang-Chul Lee ,  Jong-Woo Han ,  Young-Do Kweon

IPC分类号： H05K1/18 ,  B32B7/00 ,  B32B37/02

CPC分类号： H05K1/162 ,  H05K3/108 ,  H05K3/386 ,  H05K3/387 ,  H05K3/4602 ,  H05K3/4626 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09672 ,  Y10T428/24355

摘要： Disclosed are a substrate for a capacitor-embedded printed circuit board, a capacitor-embedded printed circuit board, and a manufacturing method thereof. The capacitor-embedded printed circuit board can include a core board, an insulation resin layer, which is stacked on the core board, a first electrode and a first circuit pattern, which are buried in the insulation resin layer, a dielectric layer, which is stacked on a surface of the insulation resin layer, a first adhesive resin layer, which is stacked on the dielectric layer, and a second electrode and a second circuit pattern, which are formed on a surface of the first adhesive resin layer to correspond with the first electrode. With the present invention, the manufacturing process can be simplified and the reliability of products can be improved by reducing the variation of the capacitor (C).

摘要翻译： 公开了用于电容器嵌入式印刷电路板的基板，电容器嵌入式印刷电路板及其制造方法。 电容器嵌入式印刷电路板可以包括堆叠在芯板上的芯板，绝缘树脂层，埋在绝缘树脂层中的第一电极和第一电路图案，介电层，其是 堆叠在绝缘树脂层的表面上，堆叠在电介质层上的第一粘合树脂层和形成在第一粘合树脂层的表面上的第二电极和第二电路图案，以对应于 第一电极。 利用本发明，可以简化制造工艺，并且可以通过减小电容器（C）的变化来提高产品的可靠性。

公开(公告)号：US20120152886A1

公开(公告)日：2012-06-21

申请号：US13403211

申请日：2012-02-23

申请人： Woon-Chun KIM ,  Sung Yi ,  Hwa-Sun Park ,  Sang-Chul Lee ,  Jong-Woo Han ,  Young-Do Kweon

发明人： Woon-Chun KIM ,  Sung Yi ,  Hwa-Sun Park ,  Sang-Chul Lee ,  Jong-Woo Han ,  Young-Do Kweon

IPC分类号： H01G13/00

CPC分类号： H05K1/162 ,  H05K3/108 ,  H05K3/386 ,  H05K3/387 ,  H05K3/4602 ,  H05K3/4626 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09672 ,  Y10T428/24355

摘要： A method of manufacturing a capacitor-embedded printed circuit board, the method including providing a substrate on which a first metal layer, a dielectric layer and an adhesive resin layer are stacked on the order thereof; etching a part of the first metal layer to form a first electrode and a first circuit pattern; compressing a surface of the substrate, on which the first electrode is formed, onto a core board by interposing an insulation resin layer; forming a second electrode and a second circuit pattern on the adhesive resin layer; stacking an insulation board on the substrate such that the second electrode and the second circuit pattern are covered; and forming a third circuit pattern on the insulation board.

摘要翻译： 一种制造电容器嵌入式印刷电路板的方法，该方法包括提供其上第一金属层，电介质层和粘合树脂层按顺序堆叠的基板; 蚀刻第一金属层的一部分以形成第一电极和第一电路图案; 通过插入绝缘树脂层将形成有第一电极的基板的表面压在芯板上; 在所述粘合树脂层上形成第二电极和第二电路图案; 在所述基板上堆叠绝缘板，使得所述第二电极和所述第二电路图案被覆盖; 以及在所述绝缘板上形成第三电路图案。

公开(公告)号：US20090049686A1

公开(公告)日：2009-02-26

申请号：US12081858

申请日：2008-04-22

申请人： Hwa-Sun Park ,  Sung Yi ,  Sang-Chul Lee ,  Jong-Woon Kim ,  Yul-Kyo Chung

发明人： Hwa-Sun Park ,  Sung Yi ,  Sang-Chul Lee ,  Jong-Woon Kim ,  Yul-Kyo Chung

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0969 ,  H05K2203/1469 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first insulation layer stacked over a first metal layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 该方法包括：在第一金属层上形成盲孔以使第一绝缘层暴露，对于包覆层叠在第一金属层上的第一绝缘层的覆金属层压板，将部件固定到第一绝缘层上 将所述部件嵌入所述盲孔中，在所述覆金属层压板的任一侧堆叠第二绝缘层和第二金属层，以及通过去除所述金属层的一部分来形成电路图案。

公开(公告)号：US07730612B2

公开(公告)日：2010-06-08

申请号：US12081858

申请日：2008-04-22

申请人： Hwa-Sun Park ,  Sung Yi ,  Sang-Chul Lee ,  Jong-Woon Kim ,  Yul-Kyo Chung

发明人： Hwa-Sun Park ,  Sung Yi ,  Sang-Chul Lee ,  Jong-Woon Kim ,  Yul-Kyo Chung

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0969 ,  H05K2203/1469 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first metal layer stacked over a first insulation layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 该方法包括：在第一绝缘层上形成盲孔以使第一绝缘层被暴露，对于包覆层叠在第一绝缘层上的第一金属层的覆金属层压板，将部件固定在第一绝缘层上 将所述部件嵌入所述盲孔中，在所述覆金属层压板的任一侧堆叠第二绝缘层和第二金属层，以及通过去除所述金属层的一部分来形成电路图案。

公开(公告)号：US20130263383A1

公开(公告)日：2013-10-10

申请号：US13597684

申请日：2012-08-29

申请人： Gun Kang ,  Mi Jung Yun ,  Won-Ju Kim ,  Sang-Chul Lee ,  Eun-Chul Shin

发明人： Gun Kang ,  Mi Jung Yun ,  Won-Ju Kim ,  Sang-Chul Lee ,  Eun-Chul Shin

IPC分类号： C14C11/00

CPC分类号： C14C3/28 ,  C14C9/02

摘要： Disclosed is a method of fabricating an automotive seat cover leather. The method includes a preparing process, a tanning process, a neutralizing process, a retanning process, an elastic material adding process, a dyeing/fatliquoring process, and a surface fixing process. After the leather has gone through the tanning process and neutralizing process, the retanning process adds a tanning agent to the leather. The elastic material adding process adds a silicon-based elastic material to induce elasticity in the retanned leather. The dyeing/fatliquoring process adds a dye to the leather in which the elastic material has been added and adds an anion fatliquoring agent to the leather to provide flexibility. The surface fixing process fixes the elastic material, dye, and fatliquoring agent on and in the leather.

摘要翻译： 公开了一种制造汽车座椅护罩皮革的方法。 该方法包括制备过程，鞣制过程，中和过程，复鞣过程，弹性材料添加过程，染色/加油过程和表面定影过程。 皮革经过鞣制工艺和中和工序后，复鞣工艺为皮革添加了鞣制剂。 弹性材料添加工艺增加了硅基弹性材料，以在复鞣革中引起弹性。 染色/加脂过程在已加入弹性材料的皮革中加入染料，并向皮革添加阴离子加油剂以提供柔韧性。 表面固着工艺将弹性材料，染料和加脂剂固定在皮革上和皮革上。

公开(公告)号：US20120266172A1

公开(公告)日：2012-10-18

申请号：US13446988

申请日：2012-04-13

申请人： Ji-Woong Byun ,  Jae-Wook Jeo ,  Seong-Jin Cho ,  Jong-Hyun Park ,  Sang-Chul Lee ,  Hae-II Hyun

发明人： Ji-Woong Byun ,  Jae-Wook Jeo ,  Seong-Jin Cho ,  Jong-Hyun Park ,  Sang-Chul Lee ,  Hae-II Hyun

IPC分类号： G06F9/455

CPC分类号： G06F9/45516

摘要： The present disclosure relates to an apparatus for controlling a virtual machine in a device. The apparatus comprises a virtualization requesting part and a controlling part. The virtualization requesting part is configured to transmit a first instruction word for controlling the virtual machine to an independent virtualization apparatus. The controlling part is configured to execute an operation corresponding to a second instruction word received from the virtualization apparatus.

摘要翻译： 本公开涉及一种用于控制设备中的虚拟机的装置。 该装置包括虚拟化请求部分和控制部分。 虚拟化请求部分被配置为向独立虚拟化设备发送用于控制虚拟机的第一指令字。 控制部被配置为执行与从虚拟化装置接收的第二指令字对应的动作。

公开(公告)号：US07977595B2

公开(公告)日：2011-07-12

申请号：US12038858

申请日：2008-02-28

申请人： Sang-Chul Lee ,  Ki-Hwan Kim ,  Hong-Ik Yang ,  Kil-Young Ahn

发明人： Sang-Chul Lee ,  Ki-Hwan Kim ,  Hong-Ik Yang ,  Kil-Young Ahn

IPC分类号： H01H5/00

CPC分类号： H01H3/3015 ,  H01H33/40 ,  H01H2003/3089 ,  H02B11/133

摘要： Provided are an air circuit breaker capable of allowing a closing spring to be automatically discharged at a pulled-out position in a pull-out type air circuit breaker and an automatic discharging apparatus for the closing spring in the air circuit breaker, the automatic discharging apparatus for the closing spring comprising a cam shaft rotation preventing unit installed on a cam shaft allowing the closing spring to be charged or discharged and configured to restrict the rotation of the cam shaft by an elastic restoring force of the closing spring, and a unit for releasing the cam shaft rotation preventing unit connected to the cam shaft rotation preventing unit and configured to allow the cam shaft to be rotated by the elastic restoring force of the closing spring according to positions where a main body of the air circuit breaker is pulled out of a cradle.

摘要翻译： 提供一种空气断路器，其能够使闭合弹簧在拉出型空气断路器中的拉出位置自动排出，以及用于空气断路器中的闭合弹簧的自动排出装置，自动排出装置 所述闭合弹簧包括安装在凸轮轴上的凸轮轴旋转防止单元，所述凸轮轴允许所述闭合弹簧被充放电并且被构造成通过所述闭合弹簧的弹性恢复力来限制所述凸轮轴的旋转;以及用于释放的单元 所述凸轮轴旋转防止单元连接到所述凸轮轴旋转防止单元，并且被构造成根据所述关闭弹簧的弹性恢复力使所述凸轮轴旋转，其中所述位置将所述空气断路器的主体从 摇篮。

公开(公告)号：US20100140747A1

公开(公告)日：2010-06-10

申请号：US12592924

申请日：2009-12-04

申请人： Seung-Man Choi ,  Soon-Sik Hwang ,  Ki-Chul Park ,  Gi-Bum Kim ,  Ki-Su Kim ,  Sang-Chul Lee ,  Bae-Kyoung Kim

发明人： Seung-Man Choi ,  Soon-Sik Hwang ,  Ki-Chul Park ,  Gi-Bum Kim ,  Ki-Su Kim ,  Sang-Chul Lee ,  Bae-Kyoung Kim

IPC分类号： H01L23/58 ,  H01L23/522 ,  H01L21/768

CPC分类号： H01L23/585 ,  H01L24/02 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042

摘要： In a method of manufacturing a semiconductor device, a pad including at least one insulating interlayer and at least one conductive wiring may be formed in a pad area of a substrate. At least one wiring may be formed adjacent to the conductive wiring. At least one insulation layer may be formed adjacent to the insulating interlayer. At least one crack preventing structure may be formed in the insulation layer. The crack preventing structure may continuously extend in the insulation layer and portions of the insulation layer may also be continuous. When a semiconductor device includes at least one crack preventing structure disposed adjacent to a pad, a degradation of the semiconductor chip caused by an external impact and/or a stress may be efficiently prevented by the crack preventing structure.

摘要翻译： 在制造半导体器件的方法中，可以在衬底的焊盘区域中形成包括至少一个绝缘中间层和至少一个导电布线的焊盘。 可以在导电布线附近形成至少一个布线。 可以在绝缘中间层附近形成至少一个绝缘层。 至少一个防裂结构可以形成在绝缘层中。 防裂结构可以在绝缘层中连续延伸，并且绝缘层的部分也可以是连续的。 当半导体器件包括邻近焊盘设置的至少一个防裂结构时，可以通过防裂结构有效地防止由外部冲击和/或应力引起的半导体芯片的劣化。

公开(公告)号：US07615145B2

公开(公告)日：2009-11-10

申请号：US11870820

申请日：2007-10-11

申请人： Jin S. Yoo ,  Sang-Chul Lee ,  Ho Dong Kim

发明人： Jin S. Yoo ,  Sang-Chul Lee ,  Ho Dong Kim

IPC分类号： C10G17/00 ,  C10G45/04

CPC分类号： C07C51/265 ,  C07C63/26 ,  C07C63/307 ,  C07C63/04 ,  C07C63/00 ,  C07C63/15

摘要： The present invention relates to a process of reducing sulfur- or nitrogen-containing compounds and producing oxygenates, and in particular to a one-pot process of reducing sulfur- or nitrogen-containing compounds and also producing oxygenates in the presence of a homogeneous catalyst such as Mn+/a first solvent or M1n+/a second solvent/M2m+/a third solvent or a mixture thereof, the process herein being useful as an excellent octane booster in the reformulated gasoline and as a cetane booster for the future oxygenated diesel in a one-pot reaction.

摘要翻译： 本发明涉及一种还原含硫或含氮化合物并生产含氧化合物的方法，特别涉及一种还原含硫或含氮化合物的一锅方法，并且在均相催化剂 作为Mn + / a第一溶剂或M1n + / a第二溶剂/ M2m + / /第三溶剂或其混合物，本发明的方法可用作重整汽油中的优异的辛烷值助催化剂，并且作为未来氧化柴油的十六烷加成剂 反应。

公开(公告)号：US08339347B2

公开(公告)日：2012-12-25

申请号：US12409681

申请日：2009-03-24

申请人： Hyeon-Seok Bae ,  Sang-Chul Lee ,  Kwang-Youl Lee

发明人： Hyeon-Seok Bae ,  Sang-Chul Lee ,  Kwang-Youl Lee

IPC分类号： G09G3/36

CPC分类号： G09G3/3696 ,  G09G2330/02

摘要： A liquid crystal display includes; a liquid crystal panel, and a DC-DC converter which receives an input voltage to generate an analog drive voltage and a gate-on voltage used to operate the liquid crystal panel, wherein the DC-DC converter includes a pulse width modulation circuit which modulates a pulse width of the analog drive voltage and the gate-on voltage, a boost converter which boosts the input voltage to output the analog drive voltage, and a charge pump which boosts one of the input voltage and the analog drive voltage to output the gate-on voltage, wherein when a high voltage stress test is performed, the DC-DC converter outputs the analog drive voltage boosted to a voltage level higher than a voltage level of the analog drive voltage during a normal operation, and outputs the gate-on voltage having a voltage level substantially equal to a voltage level of the gate-on voltage during the normal operation.

摘要翻译： 液晶显示器包括： 液晶面板和接收输入电压以产生用于操作液晶面板的模拟驱动电压和栅极导通电压的DC-DC转换器，其中DC-DC转换器包括调制脉冲宽度调制电路 模拟驱动电压和栅极导通电压的脉冲宽度，升压输入电压以输出模拟驱动电压的升压转换器，以及升压输入电压和模拟驱动电压之一以输出门极的电荷泵 - 其中当执行高压应力测试时，所述DC-DC转换器在正常操作期间将升压的模拟驱动电压输出到高于模拟驱动电压的电压电平的电压电平，并且输出门极导通 电压具有在正常操作期间基本上等于栅极导通电压的电压电平的电压电平。