Invention Application
- Patent Title: ELECTROSPUN STRUCTURES AND METHODS FOR FORMING AND USING SAME
- Patent Title (中): 用于形成和使用它们的电极结构和方法
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Application No.: US12299830Application Date: 2007-05-09
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Publication No.: US20100008994A1Publication Date: 2010-01-14
- Inventor: Darrell Reneker , Tao Han , Daniel Smith , Camden Ertley , Joseph W. Reneker
- Applicant: Darrell Reneker , Tao Han , Daniel Smith , Camden Ertley , Joseph W. Reneker
- Applicant Address: US OH Akron
- Assignee: THE UNIVERSITY OF AKRON
- Current Assignee: THE UNIVERSITY OF AKRON
- Current Assignee Address: US OH Akron
- International Application: PCT/US07/11158 WO 20070509
- Main IPC: B32B5/02
- IPC: B32B5/02 ; D02J3/00 ; B32B9/00 ; B29C70/00 ; B29C47/00 ; B01J31/06 ; H01B1/12 ; H01B1/24 ; A61K9/14 ; A61K38/16 ; A61K39/395 ; A61K39/00 ; A61K38/43 ; A61P25/22 ; A61P25/26

Abstract:
The present invention relates to structures that contain one or more fiber and/or nanofiber structures where such structures can be formed on a wide variety of structures or surfaces (e.g., asperities, flat surfaces, angled surface, hierarchical structures, etc.). In one embodiment, the present invention relates to a process for forming one or more fibers, nanofibers or structures made therefrom on a wide variety of structures or surfaces (e.g., asperities, flat surfaces, angled surface, hierarchical structures, etc.). In another embodiment, the present invention relates to a process for forming one or more fibers, nanofibers or structures made therefrom on a wide variety of structures or surfaces (e.g., asperities, flat surfaces, angled surface, hierarchical structures, etc.) where such fibers and/or structures are designed to sequester, carry and/or encapsulate one or more substances. In still another embodiment, the present invention relates to structures that contain one or more fiber and/or nanofiber structures on asperities where the nanofiber and/or fiber structures are designed to sequester, carry and/or encapsulate one or more substances.
Public/Granted literature
- US08574315B2 Electrospun structures and methods for forming and using same Public/Granted day:2013-11-05
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