发明申请
- 专利标题: HALOGEN-FREE PHOSPHOROUS EPOXY RESIN COMPOSITION
- 专利标题(中): 无卤环氧树脂组合物
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申请号: US12162611申请日: 2007-02-22
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公开(公告)号: US20100048766A1公开(公告)日: 2010-02-25
- 发明人: Yu Hsain Cheng , We Ming Te , Gary Yonggang Min
- 申请人: Yu Hsain Cheng , We Ming Te , Gary Yonggang Min
- 优先权: TW95106033 20060223
- 国际申请: PCT/US07/04837 WO 20070222
- 主分类号: C08L63/00
- IPC分类号: C08L63/00 ; C09J163/00
摘要:
The present invention relates to a polyphosphate-containing halogen-free adhesive, primarily used as an adhesive. The composition comprising the polyphosphate group compounds which effectively meets the needs for environmental protection and flame retardancy, and the high flexibility and flame retardancy of the adhesive made it suitable for using on printed circuit board, especially the flexible printed circuit board.
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