发明申请
US20100048766A1 HALOGEN-FREE PHOSPHOROUS EPOXY RESIN COMPOSITION 审中-公开
无卤环氧树脂组合物

HALOGEN-FREE PHOSPHOROUS EPOXY RESIN COMPOSITION
摘要:
The present invention relates to a polyphosphate-containing halogen-free adhesive, primarily used as an adhesive. The composition comprising the polyphosphate group compounds which effectively meets the needs for environmental protection and flame retardancy, and the high flexibility and flame retardancy of the adhesive made it suitable for using on printed circuit board, especially the flexible printed circuit board.
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