公开(公告)号：US20100048766A1

公开(公告)日：2010-02-25

申请号：US12162611

申请日：2007-02-22

申请人： Yu Hsain Cheng ,  We Ming Te ,  Gary Yonggang Min

发明人： Yu Hsain Cheng ,  We Ming Te ,  Gary Yonggang Min

IPC分类号： C08L63/00 ,  C09J163/00

CPC分类号： C08K5/5205 ,  C08G59/4261 ,  C08G59/504 ,  C08L13/00 ,  C08L19/006 ,  C08L21/00 ,  C09D163/00 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0209 ,  C08L63/00 ,  C08L2666/04

摘要： The present invention relates to a polyphosphate-containing halogen-free adhesive, primarily used as an adhesive. The composition comprising the polyphosphate group compounds which effectively meets the needs for environmental protection and flame retardancy, and the high flexibility and flame retardancy of the adhesive made it suitable for using on printed circuit board, especially the flexible printed circuit board.

摘要翻译： 本发明涉及主要用作粘合剂的含多磷酸盐的无卤素粘合剂。 包含有效满足环境保护和阻燃性需要的多磷酸酯基化合物的组合物，以及粘合剂的高柔性和阻燃性使其适用于在印刷电路板，特别是柔性印刷电路板上的使用。

公开(公告)号：US20090242823A1

公开(公告)日：2009-10-01

申请号：US12162406

申请日：2007-03-01

申请人： Karthikeyan Kanakarajan ,  Kuppusamy Kanakarajan ,  Gary Yonggang Min

发明人： Karthikeyan Kanakarajan ,  Kuppusamy Kanakarajan ,  Gary Yonggang Min

IPC分类号： H01B1/12

CPC分类号： C08G73/10 ,  H01B3/306 ,  H05K1/162 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/09309

摘要： The invention is directed to polyimide based materials having improved electrical and mechanical performance, and also to a process of making such materials. The compositions of the invention comprise: i. a polyimide base polymer in an amount of at least 60 weight percent; ii. a discontinuous phase of inorganic material present in an amount of at least 4 weight percent; iii. a non-ionic halogenated dispersing agent in an amount of at least 0.1 weight percent; and iv. up to 30 weight percent of other optional ingredients, such as, fillers, processing aids, colorants, or the like. The compositions of the invention generally exhibit excellent high frequency performance and can be manufactured by incorporating the dispersing agent and inorganic material into a polyamic acid solution and then converting the polyamic acid solution into a polyimide by conventional or non-conventional means.

摘要翻译： 本发明涉及具有改进的电气和机械性能的聚酰亚胺基材料，以及制造这种材料的方法。 本发明的组合物包括：i。 至少60重量％的聚酰亚胺基聚合物; ii。 以不小于4重量％的量存在的无机材料的不连续相; iii。 非离子卤化分散剂，其量为至少0.1重量％; 和iv。 最多30重量％的其它任选成分，例如填料，加工助剂，着色剂等。 本发明的组合物通常表现出优异的高频性能，并且可以通过将分散剂和无机材料并入聚酰胺酸溶液中，然后通过常规或非常规方法将聚酰胺酸溶液转化为聚酰亚胺来制备。