发明申请
- 专利标题: SOLID STATE IMAGING DEVICE AND FABRICATION METHOD FOR THE SAME
- 专利标题(中): 固态成像装置及其制造方法
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申请号: US12525357申请日: 2008-02-01
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公开(公告)号: US20100102368A1公开(公告)日: 2010-04-29
- 发明人: Osamu Matsushima , Masaki Takaoka , Kenichi Miyazaki , Shogo Ishizuka , Keiichiro Sakurai , Shigeru Niki
- 申请人: Osamu Matsushima , Masaki Takaoka , Kenichi Miyazaki , Shogo Ishizuka , Keiichiro Sakurai , Shigeru Niki
- 优先权: JP2007-024611 20070202
- 国际申请: PCT/JP2008/051649 WO 20080201
- 主分类号: H01L31/032
- IPC分类号: H01L31/032 ; H01L31/18
摘要:
A solid state imaging device with an easy structure in which have the high sensitivity which reaches the wide wavelength region from visible light to near infrared light wavelength region, and dark current is reduced, and a fabrication method for the same, are provided.A solid state imaging device and a fabrication method for the same, the solid state imaging device comprising: a circuit unit (30) formed on a substrate; and a photoelectric conversion unit (28) including a lower electrode layer (25) placed on the circuit unit (30), a compound semiconductor thin film (24) of chalcopyrite structure which is placed on the lower electrode layer (25) and functions as an optical absorption layer, and an optical transparent electrode layer (26) placed on the compound semiconductor thin film (24), wherein the lower electrode layer (25), the compound semiconductor thin film (24), and the optical transparent electrode layer (26) are laminated one after another on the circuit unit (30).
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