发明申请
- 专利标题: LOW COST SOI SUBSTRATES FOR MONOLITHIC SOLAR CELLS
- 专利标题(中): 用于单晶太阳能电池的低成本SOI衬底
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申请号: US12436249申请日: 2009-05-06
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公开(公告)号: US20100221867A1公开(公告)日: 2010-09-02
- 发明人: Stephen W. Bedell , Joel P. de Souza , Keith E. Fogel , Harold J. Hovel , Daniel A. Inns , Jeehwan Kim , Devendra K. Sadana , Katherine L. Saenger , Ghavam G. Shahidi
- 申请人: Stephen W. Bedell , Joel P. de Souza , Keith E. Fogel , Harold J. Hovel , Daniel A. Inns , Jeehwan Kim , Devendra K. Sadana , Katherine L. Saenger , Ghavam G. Shahidi
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L31/0376
- IPC分类号: H01L31/0376 ; H01L21/762
摘要:
A lost cost method for fabricating SOI substrates is provided. The method includes forming a stack of p-type doped amorphous Si-containing layers on a semiconductor region of a substrate by utilizing an evaporation deposition process. A solid phase recrystallization step is then performed to convert the amorphous Si-containing layers within the stack into a stack of p-type doped single crystalline Si-containing layers. After recrystallization, the single crystalline Si-containing layers are subjected to anodization and at least an oxidation step to form an SOI substrate. Solar cells and/or other semiconductor devices can be formed on the upper surface of the inventive SOI substrate.
公开/授权文献
- US2578410A Open-ended ratchet wrench 公开/授权日:1951-12-11
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