发明申请
- 专利标题： SOLID-STATE IMAGING ELEMENT, METHOD FOR FABRICATING THE SAME, AND SOLID-STATE IMAGING DEVICE
- 专利标题（中）： 固态成像元件，其制造方法和固态成像装置
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申请号： US12783086申请日： 2010-05-19
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公开(公告)号： US20100224948A1公开(公告)日： 2010-09-09
- 发明人: Yasuo TAKEUCHI , Tomoko Komatsu , Masashi Kuroda , Tetsushi Nishio , Kiyokazu Itoi
- 申请人： Yasuo TAKEUCHI , Tomoko Komatsu , Masashi Kuroda , Tetsushi Nishio , Kiyokazu Itoi
- 申请人地址： JP Osaka
- 专利权人： PANASONIC CORPORATION
- 当前专利权人： PANASONIC CORPORATION
- 当前专利权人地址： JP Osaka
- 优先权： JP2008-174660 20080703
- 主分类号： H01L31/0232
- IPC分类号： H01L31/0232 ; H01L31/18 ; H01L31/0216
摘要：
A solid-state imaging element includes a semiconductor substrate formed with a valid pixel section including a plurality of photodetector sections, spacers formed on the valid pixel section, a transparent adhesive filling gaps among the spacers, and a transparent substrate which is bonded onto the spacers using the transparent adhesive and covers the valid pixel section when viewed in plan. Electrode pad sections are formed in a region of the semiconductor substrate located outside the valid pixel section.
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