发明申请
- 专利标题： SUBSTRATE PROCESSING APPARATUS
- 专利标题（中）： 基板加工设备
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申请号： US12647952申请日： 2009-12-28
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公开(公告)号： US20100229416A1公开(公告)日： 2010-09-16
- 发明人: Yukinori ABURATANI , Seiyo NAKASHIMA , Masakazu SHIMADA
- 申请人： Yukinori ABURATANI , Seiyo NAKASHIMA , Masakazu SHIMADA
- 申请人地址： JP Tokyo
- 专利权人： HITACHI-KOKUSAI ELECTRIC INC.
- 当前专利权人： HITACHI-KOKUSAI ELECTRIC INC.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2009-063161 20090316
- 主分类号： F26B25/08
- IPC分类号： F26B25/08
摘要：
Provided is a substrate processing apparatus that can decrease the time necessary for cooling a processed wafer for improving the throughput. The substrate processing apparatus comprises: a process chamber configured to process a substrate; a substrate supporter configured to support the substrate and load the substrate into the process chamber; a transfer mechanism configured to carry the substrate to the substrate supporter; and a non-sealing type shield part installed between the substrate supporter and the transfer mechanism.
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