摘要:
Provided is a substrate processing apparatus that can decrease the time necessary for cooling a processed wafer for improving the throughput. The substrate processing apparatus comprises: a process chamber configured to process a substrate; a substrate supporter configured to support the substrate and load the substrate into the process chamber; a transfer mechanism configured to carry the substrate to the substrate supporter; and a non-sealing type shield part installed between the substrate supporter and the transfer mechanism.
摘要:
Provided is a substrate processing apparatus suppressing the vibration of a cover in an initial stage of unloading a boat from a process pipe. The substrate processing apparatus comprises: a boat for placing a substrate; a process pipe receiving the boat; a cover on which the boat is placed, the cover opening and closing a furnace port installed on a lower end of the process pipe; an elevation mechanism moving the cover upward and downward; a motor driving the elevation mechanism; a sealing member sealing a space between the cover and a lower end surface of the process pipe; and a controller controlling torque of the motor such that the substrate is maintained a rest position within the boat in a deformation recovery period of the cover occurring when the sealing member is removed from a surface of the cover or the lower end surface of the process pipe.
摘要:
Provided are a substrate processing apparatus and a method of manufacturing a semiconductor device. The apparatus comprises a substrate processing region, a container carrying region, a housing, first and second openings, an exhaust port, a door body, and a control unit. The substrate processing region comprises a process furnace. The container carrying region comprises a carrying device. In the housing, the substrate processing region and the container carrying region are provided. The first opening is formed at the housing for carrying the container between the container carrying region and an outside region of the housing. The second opening is formed at the housing for sucking gas. The exhaust port is configured to exhaust gas from the container carrying region. The door body closes the first and second openings. The control unit controls the door body to open one of the first and second openings and close the other.
摘要:
There is provided a substrate processing apparatus capable of reducing a substrate carrying time. The substrate processing apparatus comprises a transfer machine configured to carry a substrate, a holding part configured to hold the substrate on the transfer machine, and a detector configured to detect whether the substrate is held on the transfer machine based on an operation of the holding part.