SUBSTRATE PROCESSING APPARATUS
    1.
    发明申请
    SUBSTRATE PROCESSING APPARATUS 审中-公开
    基板加工设备

    公开(公告)号:US20100229416A1

    公开(公告)日:2010-09-16

    申请号:US12647952

    申请日:2009-12-28

    IPC分类号: F26B25/08

    摘要: Provided is a substrate processing apparatus that can decrease the time necessary for cooling a processed wafer for improving the throughput. The substrate processing apparatus comprises: a process chamber configured to process a substrate; a substrate supporter configured to support the substrate and load the substrate into the process chamber; a transfer mechanism configured to carry the substrate to the substrate supporter; and a non-sealing type shield part installed between the substrate supporter and the transfer mechanism.

    摘要翻译: 提供了一种可以减少冷却处理晶片所需的时间以提高生产量的基板处理装置。 基板处理装置包括:处理室,被配置为处理基板; 衬底支撑件,其构造成支撑所述衬底并将所述衬底加载到所述处理室中; 传送机构,其构造成将所述基板运送到所述基板支撑件; 以及安装在基板支撑件和转印机构之间的非密封型屏蔽部。

    SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    2.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
    基板加工装置及制造半导体装置的方法

    公开(公告)号:US20110170989A1

    公开(公告)日:2011-07-14

    申请号:US13004495

    申请日:2011-01-11

    IPC分类号: H01L21/673

    CPC分类号: H01L21/67109

    摘要: Provided is a substrate processing apparatus suppressing the vibration of a cover in an initial stage of unloading a boat from a process pipe. The substrate processing apparatus comprises: a boat for placing a substrate; a process pipe receiving the boat; a cover on which the boat is placed, the cover opening and closing a furnace port installed on a lower end of the process pipe; an elevation mechanism moving the cover upward and downward; a motor driving the elevation mechanism; a sealing member sealing a space between the cover and a lower end surface of the process pipe; and a controller controlling torque of the motor such that the substrate is maintained a rest position within the boat in a deformation recovery period of the cover occurring when the sealing member is removed from a surface of the cover or the lower end surface of the process pipe.

    摘要翻译: 提供一种在从处理管卸载船的初始阶段抑制盖的振动的基板处理装置。 基板处理装置包括:用于放置基板的船; 接收船的加工管; 其上放置船的盖,盖打开和关闭安装在处理管的下端的炉口; 升降机构向上和向下移动盖子; 驱动升降机构的电机; 密封构件,其密封所述盖和所述处理管的下端面之间的空间; 以及控制器,其控制所述马达的扭矩,使得当所述密封构件从所述盖的表面或所述处理管的下端表面移除时,在所述盖的变形恢复期间,所述基板保持在所述船内的静止位置 。

    SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    3.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    基板加工装置及制造半导体装置的方法

    公开(公告)号:US20090269937A1

    公开(公告)日:2009-10-29

    申请号:US12365073

    申请日:2009-02-03

    IPC分类号: H01L21/02 C23C16/44

    CPC分类号: C23C16/4401

    摘要: Provided are a substrate processing apparatus and a method of manufacturing a semiconductor device. The apparatus comprises a substrate processing region, a container carrying region, a housing, first and second openings, an exhaust port, a door body, and a control unit. The substrate processing region comprises a process furnace. The container carrying region comprises a carrying device. In the housing, the substrate processing region and the container carrying region are provided. The first opening is formed at the housing for carrying the container between the container carrying region and an outside region of the housing. The second opening is formed at the housing for sucking gas. The exhaust port is configured to exhaust gas from the container carrying region. The door body closes the first and second openings. The control unit controls the door body to open one of the first and second openings and close the other.

    摘要翻译: 提供了一种基板处理装置和半导体装置的制造方法。 该装置包括基板处理区域,容器承载区域,壳体,第一和第二开口,排气口,门体和控制单元。 基板处理区域包括工艺炉。 容器承载区域包括承载装置。 在壳体中设置基板处理区域和容器承载区域。 第一开口形成在壳体处,用于将容器携带在容器承载区域和壳体的外部区域之间。 第二开口形成在壳体处用于吸入气体。 排气口被构造成从容器承载区域排出气体。 门体关闭第一和第二开口。 控制单元控制门体打开第一和第二开口中的一个,并将另一个打开。

    SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    4.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 审中-公开
    基板加工设备和半导体器件制造方法

    公开(公告)号:US20100280653A1

    公开(公告)日:2010-11-04

    申请号:US12760113

    申请日:2010-04-14

    IPC分类号: H01L21/677 G06F7/00

    摘要: There is provided a substrate processing apparatus capable of reducing a substrate carrying time. The substrate processing apparatus comprises a transfer machine configured to carry a substrate, a holding part configured to hold the substrate on the transfer machine, and a detector configured to detect whether the substrate is held on the transfer machine based on an operation of the holding part.

    摘要翻译: 提供了能够减少基板搬运时间的基板处理装置。 基板处理装置包括配置成承载基板的转印机构,将基板保持在转印机上的保持部,以及基于保持部的操作来检测基板是否被保持在转印机上的检测器 。