发明申请
US20100230743A1 SELF-ALIGNED PATTERNING METHOD BY USING NON-CONFORMAL FILM AND ETCH FOR FLASH MEMORY AND OTHER SEMICONDUCTOR APPLICATIONS
有权
通过使用非一致性膜和闪存存储器和其他半导体应用的自对准图形方法
- 专利标题: SELF-ALIGNED PATTERNING METHOD BY USING NON-CONFORMAL FILM AND ETCH FOR FLASH MEMORY AND OTHER SEMICONDUCTOR APPLICATIONS
- 专利标题(中): 通过使用非一致性膜和闪存存储器和其他半导体应用的自对准图形方法
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申请号: US12788177申请日: 2010-05-26
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公开(公告)号: US20100230743A1公开(公告)日: 2010-09-16
- 发明人: Shenqing Fang , Jihwan Choi , Calvin Gabriel , Fei Wang , Angela Hui , Alexander Nickel , Zubin Patel , Phillip Jones , Mark Chang , Minh-Van Ngo
- 申请人: Shenqing Fang , Jihwan Choi , Calvin Gabriel , Fei Wang , Angela Hui , Alexander Nickel , Zubin Patel , Phillip Jones , Mark Chang , Minh-Van Ngo
- 主分类号: H01L29/792
- IPC分类号: H01L29/792
摘要:
A method for fabricating a memory device with a self-aligned trap layer which is optimized for scaling is disclosed. In the present invention, a non-conformal film is deposited over the charge trapping layer to form a thick film on top of the core source/drain region and a pinch off and a void or a narrow channel at the top of the STI trench. An etch is performed on the non-conformal film to open pinch-off or widen the narrow channel in the non-conformal. The trapping layer is then completely or partially etched between the core cells. The non-conformal film is removed. And a top oxide is formed. The top oxide converts the remaining trap layer to oxide if the trapping layer is partially etched and thus isolate the trap layer.
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