发明申请
- 专利标题： RECONFIGURED WAFER ALIGNMENT
- 专利标题（中）： 重构波形对准
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申请号： US12401111申请日： 2009-03-10
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公开(公告)号： US20100233831A1公开(公告)日： 2010-09-16
- 发明人: Jens Pohl , Edward Fuergut , Markus Brunnbauer , Thorsten Meyer , Peter Strobel , Daniel Porwol , Ulrich Wachter
- 申请人： Jens Pohl , Edward Fuergut , Markus Brunnbauer , Thorsten Meyer , Peter Strobel , Daniel Porwol , Ulrich Wachter
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/66
摘要：
A method of manufacturing semiconductor device comprises placing multiple chips onto a carrier. An encapsulation material is applied to the multiple chips and the carrier for forming an encapsulation workpiece. The encapsulation workpiece having a first main face facing the carrier and a second main face opposite to the first main face. Further, marking elements are applied to the encapsulation workpiece relative to the multiple chips, the marking elements being detectable on the first main face and on the second main face.
公开/授权文献
- US07943423B2 Reconfigured wafer alignment 公开/授权日：2011-05-17
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