公开(公告)号：US08906749B2

公开(公告)日：2014-12-09

申请号：US13432633

申请日：2012-03-28

申请人： Michael Bauer ,  Daniel Porwol ,  Ulrich Wachter

发明人： Michael Bauer ,  Daniel Porwol ,  Ulrich Wachter

IPC分类号： H01L21/00 ,  H01L23/22

CPC分类号： H01L23/29 ,  H01L21/565 ,  H01L23/24 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3128 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00

摘要： A semiconductor device and a method for making a semiconductor device are disclosed. In an embodiment a semiconductor device includes a semiconductor chip and a fiber reinforced encapsulation layer at least partly covering the semiconductor chip.

摘要翻译： 公开了半导体器件和制造半导体器件的方法。 在一个实施例中，半导体器件包括至少部分覆盖半导体芯片的半导体芯片和纤维增强封装层。

公开(公告)号：US20140035154A1

公开(公告)日：2014-02-06

申请号：US13564922

申请日：2012-08-02

申请人： Ottmar Geitner ,  Walter Hartner ,  Maciej Wojnowski ,  Ulrich Wachter ,  Michael Bauer ,  Andreas Stueckjuergen

发明人： Ottmar Geitner ,  Walter Hartner ,  Maciej Wojnowski ,  Ulrich Wachter ,  Michael Bauer ,  Andreas Stueckjuergen

IPC分类号： H01L23/31 ,  H01L21/56

CPC分类号： H01L24/96 ,  H01L23/3128 ,  H01L23/49855 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2224/24051 ,  H01L2224/32245 ,  H01L2224/73151 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/142 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/0103 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2224/13 ,  H01L2224/21 ,  H01L2924/00 ,  H01L2924/00014

摘要： A chip package is provided, the chip package including: a chip including at least one contact pad formed on a chip front side; an encapsulation material at least partially surrounding the chip and covering the at least one contact pad; and at least one electrical interconnect formed through the encapsulation material, wherein the at least one electrical interconnect is configured to electrically redirect the at least one contact pad from a chip package first side at the chip front side to at least one solder structure formed over a chip package second side at a chip back side.

摘要翻译： 提供了芯片封装，芯片封装包括：芯片，包括形成在芯片正面上的至少一个接触焊盘; 至少部分地围绕所述芯片并且覆盖所述至少一个接触垫的封装材料; 以及通过所述封装材料形成的至少一个电互连，其中所述至少一个电互连构造成将所述至少一个接触焊盘从所述芯片前侧的芯片封装第一侧电重定向到形成在所述芯片前侧上的至少一个焊料结构 芯片封装第二面在芯片背面。

公开(公告)号：US07943423B2

公开(公告)日：2011-05-17

申请号：US12401111

申请日：2009-03-10

申请人： Jens Pohl ,  Edward Fuergut ,  Markus Brunnbauer ,  Thorsten Meyer ,  Peter Strobel ,  Daniel Porwol ,  Ulrich Wachter

发明人： Jens Pohl ,  Edward Fuergut ,  Markus Brunnbauer ,  Thorsten Meyer ,  Peter Strobel ,  Daniel Porwol ,  Ulrich Wachter

IPC分类号： H01L21/00

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacturing semiconductor device comprises placing multiple chips onto a carrier. An encapsulation material is applied to the multiple chips and the carrier for forming an encapsulation workpiece. The encapsulation workpiece having a first main face facing the carrier and a second main face opposite to the first main face. Further, marking elements are applied to the encapsulation workpiece relative to the multiple chips, the marking elements being detectable on the first main face and on the second main face.

摘要翻译： 制造半导体器件的方法包括将多个芯片放置在载体上。 将封装材料施加到多个芯片和用于形成封装工件的载体。 封装工件具有面向载体的第一主面和与第一主面相对的第二主面。 此外，标记元件相对于多个芯片施加到封装工件，标记元件可在第一主面和第二主面上检测。

公开(公告)号：US20100233831A1

公开(公告)日：2010-09-16

申请号：US12401111

申请日：2009-03-10

申请人： Jens Pohl ,  Edward Fuergut ,  Markus Brunnbauer ,  Thorsten Meyer ,  Peter Strobel ,  Daniel Porwol ,  Ulrich Wachter

发明人： Jens Pohl ,  Edward Fuergut ,  Markus Brunnbauer ,  Thorsten Meyer ,  Peter Strobel ,  Daniel Porwol ,  Ulrich Wachter

IPC分类号： H01L21/50 ,  H01L21/66

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacturing semiconductor device comprises placing multiple chips onto a carrier. An encapsulation material is applied to the multiple chips and the carrier for forming an encapsulation workpiece. The encapsulation workpiece having a first main face facing the carrier and a second main face opposite to the first main face. Further, marking elements are applied to the encapsulation workpiece relative to the multiple chips, the marking elements being detectable on the first main face and on the second main face.

摘要翻译： 制造半导体器件的方法包括将多个芯片放置在载体上。 将封装材料施加到多个芯片和用于形成封装工件的载体。 封装工件具有面向载体的第一主面和与第一主面相对的第二主面。 此外，标记元件相对于多个芯片施加到封装工件，标记元件可在第一主面和第二主面上检测。

公开(公告)号：US09955756B2

公开(公告)日：2018-05-01

申请号：US13575515

申请日：2011-01-26

申请人： Ulrich Klafke ,  Mario Eckmann ,  Ole Scharnberg ,  Jens Albrecht ,  Sandra Kleinke ,  Wolf Ulrich Wachter

发明人： Ulrich Klafke ,  Mario Eckmann ,  Ole Scharnberg ,  Jens Albrecht ,  Sandra Kleinke ,  Wolf Ulrich Wachter

IPC分类号： A44B11/25 ,  B32B1/00

CPC分类号： A44B11/2546 ,  A44B11/2503 ,  A44B11/2507 ,  A44B11/2511 ,  A44B11/2549 ,  A44B11/2576 ,  B32B1/00 ,  Y10T428/1352 ,  Y10T428/1386

摘要： A shell element for the buckle cover of a seat belt buckle is disclosed. The shell element comprises a base body made of a hard elastomer and an outer and an inner surface. So that when the buckle cover bears against a further vehicle element with a hard surface, no wear and no undesirable noise is generated and so that the seat belt buckle permanently has attractive visual and haptic properties, a further element made of a soft elastomer is directly connected to the base body and is connected thereto by a material and/or positive connection, said further element forming at least one part of the outer surface of the shell element.

公开(公告)号：US20140109349A1

公开(公告)日：2014-04-24

申请号：US13699553

申请日：2011-05-07

申请人： Joakim Blank ,  Wolf-Ulrich Wachter ,  Jan Christoph Storch

发明人： Joakim Blank ,  Wolf-Ulrich Wachter ,  Jan Christoph Storch

IPC分类号： A44B11/00

CPC分类号： A44B11/00 ,  A44B11/2546 ,  A44B11/2576 ,  F16B21/084 ,  Y10T24/4002 ,  Y10T29/49947

摘要： What is described is a buckle cap for a belt buckle having two interconnected half-shells (10, 20) and connecting units which connect both half-shells (10, 20) to one another. Each connecting unit comprises at least one hole in each half-shell (10, 20) and a connecting pin (30) which is ribbed at least in certain sections, wherein one section of the connecting pin (30) is situated in the hole of the first connecting unit (10) and a second section of the connecting pin (30) is situated in the hole of the second half-shell (20). In order to achieve an easy mounting capability the hole in the first half-shell (10) is a through-hole (12) through which the connecting pin (30, 30′) extends completely, and the connecting pin (30, 30′) has a head (34, 34′) which is thickened with respect to the sections situated in the holes, said head adjoining the section of the connecting pin (30) which extends through the through-hole (12) and being situated outside the through-hole (12).

摘要翻译： 所描述的是用于带扣的带扣，其具有两个互连的半壳（10,20）和将两个壳（10,20）彼此连接的连接单元。 每个连接单元包括在每个半壳（10,20）中的至少一个孔和至少在某些部分被肋状的连接销（30），其中连接销（30）的一个部分位于 第一连接单元（10）和连接销（30）的第二部分位于第二半壳（20）的孔中。 为了实现容易的安装能力，第一半壳（10）中的孔是连接销（30,30'）完全延伸的通孔（12），连接销（30,30'） ）具有相对于位于孔中的部分加厚的头部（34,34'），所述头部邻接连接销（30）的延伸穿过通孔（12）的部分并位于 通孔（12）。

公开(公告)号：US08669655B2

公开(公告)日：2014-03-11

申请号：US13564922

申请日：2012-08-02

申请人： Ottmar Geitner ,  Walter Hartner ,  Maciej Wojnowski ,  Ulrich Wachter ,  Michael Bauer ,  Andreas Stueckjuergen

发明人： Ottmar Geitner ,  Walter Hartner ,  Maciej Wojnowski ,  Ulrich Wachter ,  Michael Bauer ,  Andreas Stueckjuergen

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/40 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/4763

CPC分类号： H01L24/96 ,  H01L23/3128 ,  H01L23/49855 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2224/24051 ,  H01L2224/32245 ,  H01L2224/73151 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/142 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/0103 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2224/13 ,  H01L2224/21 ,  H01L2924/00 ,  H01L2924/00014

摘要： A chip package is provided, the chip package including: a chip including at least one contact pad formed on a chip front side; an encapsulation material at least partially surrounding the chip and covering the at least one contact pad; and at least one electrical interconnect formed through the encapsulation material, wherein the at least one electrical interconnect is configured to electrically redirect the at least one contact pad from a chip package first side at the chip front side to at least one solder structure formed over a chip package second side at a chip back side.

摘要翻译： 提供了芯片封装，芯片封装包括：芯片，包括形成在芯片正面上的至少一个接触焊盘; 至少部分地围绕所述芯片并且覆盖所述至少一个接触垫的封装材料; 以及通过所述封装材料形成的至少一个电互连，其中所述至少一个电互连构造成将所述至少一个接触焊盘从所述芯片前侧的芯片封装第一侧电重定向至形成在所述芯片前侧的至少一个焊料结构 芯片封装第二面在芯片背面。

公开(公告)号：US20140035127A1

公开(公告)日：2014-02-06

申请号：US13563833

申请日：2012-08-01

申请人： Josef Hirtreiter ,  Walter Hartner ,  Ulrich Wachter ,  Juergen Foerster

发明人： Josef Hirtreiter ,  Walter Hartner ,  Ulrich Wachter ,  Juergen Foerster

IPC分类号： H01L23/48 ,  H01L21/283

CPC分类号： H01L21/283 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/02331 ,  H01L2224/02379 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05166 ,  H01L2224/05186 ,  H01L2224/05548 ,  H01L2224/05557 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/12105 ,  H01L2224/13006 ,  H01L2224/13024 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/35121 ,  H01L2924/01015 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01074 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method for manufacturing a chip package is provided. The method includes: forming an electrically insulating material over a chip side; selectively removing at least part of the electrically insulating material thereby forming a trench in the electrically insulating material, depositing electrically conductive material in the trench wherein the electrically conductive material is electrically connected to at least one contact pad formed over the chip side; forming an electrically conductive structure over the electrically insulating material, wherein at least part of the electrically conductive structure is in direct physical and electrical connection with the electrically conductive material; and depositing a joining structure over the electrically conductive structure.

摘要翻译： 提供了一种制造芯片封装的方法。 该方法包括：在芯片侧上形成电绝缘材料; 选择性地去除所述电绝缘材料的至少一部分，从而在所述电绝缘材料中形成沟槽，在所述沟槽中沉积导电材料，其中所述导电材料电连接到在所述芯片侧上形成的至少一个接触焊盘; 在所述电绝缘材料上形成导电结构，其中所述导电结构的至少一部分与所述导电材料直接物理和电连接; 以及在所述导电结构上沉积接合结构。

公开(公告)号：US08912087B2

公开(公告)日：2014-12-16

申请号：US13563833

申请日：2012-08-01

申请人： Josef Hirtreiter ,  Walter Hartner ,  Ulrich Wachter ,  Juergen Foerster

发明人： Josef Hirtreiter ,  Walter Hartner ,  Ulrich Wachter ,  Juergen Foerster

IPC分类号： H01L21/44 ,  H01L23/48 ,  H01L21/283 ,  H01L23/00

CPC分类号： H01L21/283 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/02331 ,  H01L2224/02379 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05166 ,  H01L2224/05186 ,  H01L2224/05548 ,  H01L2224/05557 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/12105 ,  H01L2224/13006 ,  H01L2224/13024 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/35121 ,  H01L2924/01015 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01074 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method for manufacturing a chip package is provided. The method includes: forming an electrically insulating material over a chip side; selectively removing at least part of the electrically insulating material thereby forming a trench in the electrically insulating material, depositing electrically conductive material in the trench wherein the electrically conductive material is electrically connected to at least one contact pad formed over the chip side; forming an electrically conductive structure over the electrically insulating material, wherein at least part of the electrically conductive structure is in direct physical and electrical connection with the electrically conductive material; and depositing a joining structure over the electrically conductive structure.

摘要翻译： 提供了一种制造芯片封装的方法。 该方法包括：在芯片侧上形成电绝缘材料; 选择性地去除所述电绝缘材料的至少一部分，从而在所述电绝缘材料中形成沟槽，在所述沟槽中沉积导电材料，其中所述导电材料电连接到在所述芯片侧上形成的至少一个接触焊盘; 在所述电绝缘材料上形成导电结构，其中所述导电结构的至少一部分与所述导电材料直接物理和电连接; 以及在所述导电结构上沉积接合结构。

公开(公告)号：US20130256922A1

公开(公告)日：2013-10-03

申请号：US13432633

申请日：2012-03-28

申请人： Michael Bauer ,  Daniel Porwol ,  Ulrich Wachter

发明人： Michael Bauer ,  Daniel Porwol ,  Ulrich Wachter

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L21/78

CPC分类号： H01L23/29 ,  H01L21/565 ,  H01L23/24 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3128 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00

摘要： In a method for fabricating a semiconductor device, a carrier and at least one semiconductor chip are provided.

摘要翻译： 在制造半导体器件的方法中，提供载体和至少一个半导体芯片。