发明申请
US20100244166A1 Multilayer wiring substrate, stack structure sensor package, and method of manufacturing stack structure sensor package
有权
多层布线基板，堆叠结构传感器封装，以及堆叠结构传感器封装的制造方法
- 专利标题： Multilayer wiring substrate, stack structure sensor package, and method of manufacturing stack structure sensor package
- 专利标题（中）： 多层布线基板，堆叠结构传感器封装，以及堆叠结构传感器封装的制造方法
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申请号： US12659258申请日： 2010-03-02
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公开(公告)号： US20100244166A1公开(公告)日： 2010-09-30
- 发明人: Noriko Shibuta , Tohru Terasaki , Tomoyasu Yamada , Nobuo Naito , Yukihiko Tsukuda , Ryu Nonoyama
- 申请人： Noriko Shibuta , Tohru Terasaki , Tomoyasu Yamada , Nobuo Naito , Yukihiko Tsukuda , Ryu Nonoyama
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2009-083658 20090330
- 主分类号： H01L31/0232
- IPC分类号： H01L31/0232 ; H05K1/11 ; H01L31/18
摘要：
A multilayer wiring substrate has a through hole that passes from a first surface through to a second surface. The multilayer wiring substrate includes an electrical connection terminal formed in at least one of an inner edge portion which is a periphery of the through hole, an outer edge portion which is an outer periphery of the substrate, and a non-edge portion, on at least one of the first surface and the second surface. The electrical connection terminal has a castellation structure that does not pass through to a surface opposite to a formation surface.
公开/授权文献
- US08446002B2 Multilayer wiring substrate having a castellation structure 公开/授权日：2013-05-21
信息查询
IPC分类:
