公开(公告)号：US08446002B2

公开(公告)日：2013-05-21

申请号：US12659258

申请日：2010-03-02

申请人： Noriko Shibuta ,  Tohru Terasaki ,  Tomoyasu Yamada ,  Nobuo Naito ,  Yukihiko Tsukuda ,  Ryu Nonoyama

发明人： Noriko Shibuta ,  Tohru Terasaki ,  Tomoyasu Yamada ,  Nobuo Naito ,  Yukihiko Tsukuda ,  Ryu Nonoyama

IPC分类号： H01L23/053 ,  H01L23/12 ,  H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/00 ,  H01L29/73 ,  H01L29/74 ,  H01L31/111 ,  H01L31/00 ,  H01L29/40

CPC分类号： H01L27/14618 ,  H01L24/16 ,  H01L24/31 ,  H01L24/48 ,  H01L24/73 ,  H01L27/14621 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/04042 ,  H01L2224/16 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A multilayer wiring substrate has a through hole that passes from a first surface through to a second surface. The multilayer wiring substrate includes an electrical connection terminal formed in at least one of an inner edge portion which is a periphery of the through hole, an outer edge portion which is an outer periphery of the substrate, and a non-edge portion, on at least one of the first surface and the second surface. The electrical connection terminal has a castellation structure that does not pass through to a surface opposite to a formation surface.

摘要翻译： 多层布线基板具有从第一表面通过到第二表面的通孔。 多层布线基板包括形成在通孔周边的内边缘部分中的至少一个中的电连接端子，作为基板的外周的外边缘部分和非边缘部分 第一表面和第二表面中的至少一个。 电连接端子具有不通过与形成表面相对的表面的星座结构。

公开(公告)号：US20100244166A1

公开(公告)日：2010-09-30

申请号：US12659258

申请日：2010-03-02

申请人： Noriko Shibuta ,  Tohru Terasaki ,  Tomoyasu Yamada ,  Nobuo Naito ,  Yukihiko Tsukuda ,  Ryu Nonoyama

发明人： Noriko Shibuta ,  Tohru Terasaki ,  Tomoyasu Yamada ,  Nobuo Naito ,  Yukihiko Tsukuda ,  Ryu Nonoyama

IPC分类号： H01L31/0232 ,  H05K1/11 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L24/16 ,  H01L24/31 ,  H01L24/48 ,  H01L24/73 ,  H01L27/14621 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/04042 ,  H01L2224/16 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A multilayer wiring substrate has a through hole that passes from a first surface through to a second surface. The multilayer wiring substrate includes an electrical connection terminal formed in at least one of an inner edge portion which is a periphery of the through hole, an outer edge portion which is an outer periphery of the substrate, and a non-edge portion, on at least one of the first surface and the second surface. The electrical connection terminal has a castellation structure that does not pass through to a surface opposite to a formation surface.

摘要翻译： 多层布线基板具有从第一表面通过到第二表面的通孔。 多层布线基板包括形成在通孔周边的内边缘部分中的至少一个中的电连接端子，作为基板的外周的外边缘部分和非边缘部分 第一表面和第二表面中的至少一个。 电连接端子具有不通过与形成表面相对的表面的星座结构。

公开(公告)号：US08344501B2

公开(公告)日：2013-01-01

申请号：US12659258

申请日：2010-03-02

申请人： Noriko Shibuta ,  Tohru Terasaki ,  Tomoyasu Yamada ,  Nobuo Naito ,  Yukihiko Tsukuda ,  Ryu Nonoyama

发明人： Noriko Shibuta ,  Tohru Terasaki ,  Tomoyasu Yamada ,  Nobuo Naito ,  Yukihiko Tsukuda ,  Ryu Nonoyama

IPC分类号： H01L23/053 ,  H01L23/12 ,  H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/00 ,  H01L29/73 ,  H01L29/74 ,  H01L31/111 ,  H01L31/0203 ,  H01L31/00 ,  H01L29/40

摘要： A multilayer wiring substrate has a through hole that passes from a first surface through to a second surface. The multilayer wiring substrate includes an electrical connection terminal formed in at least one of an inner edge portion which is a periphery of the through hole, an outer edge portion which is an outer periphery of the substrate, and a non-edge portion, on at least one of the first surface and the second surface. The electrical connection terminal has a castellation structure that does not pass through to a surface opposite to a formation surface.