发明申请
- 专利标题： METHOD AND APPARATUS FOR BRITTLE MATERIALS PROCESSING
- 专利标题（中）： 用于脆性材料加工的方法和装置
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申请号： US12753509申请日： 2010-04-02
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公开(公告)号： US20100252540A1公开(公告)日： 2010-10-07
- 发明人: Weisheng Lei , Hisashi Matsumoto , Glenn Simenson , Guangyu Li , Jeffrey Howerton , David Childers , Edward Johnson , Jeffrey Albelo
- 申请人： Weisheng Lei , Hisashi Matsumoto , Glenn Simenson , Guangyu Li , Jeffrey Howerton , David Childers , Edward Johnson , Jeffrey Albelo
- 申请人地址： US OR Portland
- 专利权人： ELECTRO SCIENTIFIC INDUSTRIES, INC.
- 当前专利权人： ELECTRO SCIENTIFIC INDUSTRIES, INC.
- 当前专利权人地址： US OR Portland
- 主分类号： B23K26/00
- IPC分类号： B23K26/00
摘要：
An improved method for laser machining features in brittle materials 8 such as glass is presented, wherein a tool path 10 related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses 12. Laser pulses 12 applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses 12 being applied adjacent to a previous pulse location.