公开(公告)号：US20250001524A1

公开(公告)日：2025-01-02

申请号：US18735240

申请日：2024-06-06

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Mark A. UNRATH ,  Andrew BERWICK ,  Alexander A. MYACHIN

IPC: B23K26/364 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/073 ,  B23K26/082 ,  B23K101/40 ,  H01L21/48

Abstract: A system includes a laser source, a galvanometer mirror system, an f-theta scan lens and an acousto-optic deflector (AOD) system. The AOD system is operated to deflect a beam path along which a laser beam propagates in a manner that corrects for scan field distortion induced by one or both of the f-theta lens and galvanometer mirror system.

公开(公告)号：US20240391030A1

公开(公告)日：2024-11-28

申请号：US18797580

申请日：2024-08-08

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Hisashi MATSUMOTO ,  Jan KLEINERT ,  Zhibin LIN

IPC: B23K26/382 ,  B23K26/0622 ,  B23K26/402 ,  B23K103/00

Abstract: A method for forming a through-via in a substrate having opposing first and second surfaces can include directing a focused beam of laser pulses through the first surface and through the second surface of the substrate. The focused beam of laser pulses can have a wavelength to which the substrate is at least partially transparent, and an optical intensity less than an optical breakdown intensity of the substrate. The focused beam of laser pulses may have a pulse repetition rate, a peak optical intensity and an average power at the substrate driving a cumulative heating effect to melt a region of the substrate. The pulses may have a pulse width, and wherein the peak optical intensity, pulse repetition rate, average power and pulse width are selected such that the through-via is formed in less than 120 μs.

公开(公告)号：US20240286217A1

公开(公告)日：2024-08-29

申请号：US18570791

申请日：2022-06-14

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Joe HASTY ,  Jay DAVIS

IPC: B23K26/06 ,  B23K26/70 ,  G01J1/42 ,  G02F1/29 ,  G02F1/33

CPC classification number: B23K26/06 ,  B23K26/705 ,  G01J1/42 ,  G02F1/292 ,  G02F1/33 ,  G01J2001/4247 ,  G02F2203/24

Abstract: Numerous embodiments of a laser-processing apparatus are disclosed. In one embodiment, the laser-processing apparatus includes a laser source operative to generate a beam of laser energy, an acousto-optic deflector (AOD) arranged within a beam path, a controller coupled to the AOD, and a beam analysis system operative to measure characteristics of the beam, generate measurement data representative of the measured beam characteristics, and transmit the measurement data to a controller operative to control the operation of the AOD based on that measurement data. In another embodiment, the laser-processing apparatus includes a system for characterization of cross-axis wobble of a galvanometer mirror, comprising a reference laser source configured to emit a reference laser beam, a reflective surface formed on the galvanometer mirror and configured to reflect the reference laser beam to a sensor configured to output a signal representative of the position of the reference beam to a controller.

公开(公告)号：US12070819B2

公开(公告)日：2024-08-27

申请号：US17272155

申请日：2019-10-02

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Hisashi Matsumoto ,  Jan Kleinert ,  Zhibin Lin

IPC: B23K26/382 ,  B23K26/0622 ,  B23K26/402 ,  B23K103/00

CPC classification number: B23K26/382 ,  B23K26/0624 ,  B23K26/402 ,  B23K2103/50

Abstract: A method for forming a through-via in a substrate having opposing first and second surfaces can include directing a focused beam of laser pulses into the substrate through the first surface of the substrate and, subsequently, through the second surface of the substrate. The focused beam of laser pulses can have a wavelength to which the substrate is at least substantially transparent and a beam waist of the focused beam of laser pulses is closer to the second surface than to the first surface. The focused beam of laser pulses is characterized by a pulse repetition rate, a peak optical intensity at the substrate and an average power at the substrate sufficient to: melt a region of the substrate near the second surface, thereby creating a melt zone within the substrate; propagate the melt zone toward the first surface; and vaporize or boil material of the substrate and located within the melt zone.

公开(公告)号：US20230390866A1

公开(公告)日：2023-12-07

申请号：US18252059

申请日：2021-11-23

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： James BROOKHYSER ,  Jan KLEINERT ,  Jered RICHTER ,  Mark UNRATH

IPC: B23K26/082 ,  B23K26/06

CPC classification number: B23K26/0821 ,  B23K26/0648 ,  B23K26/0676 ,  B23K26/0643 ,  B23K26/0665

Abstract: Numerous embodiments of optical relay systems are disclosed. In one embodiment, a laser-processing apparatus includes an optical relay system configured to correct for beam placement errors by maintaining the optical path length of a beam of laser energy between a first positioner and a scan lens. In another embodiment, the optical relay system may include a first lens, a second lens, and a zoom lens assembly arranged between the first lens and the second lens, wherein the zoom lens assembly includes a first lens group and a second lens group. The zoom lens assembly may be movable relative to the first lens and the second lens (e.g., mounted on a positioner, such as a motion stage). The distance between the lenses of the first lens group and the distance between the lenses of the second lens group may be fixed or variable.

公开(公告)号：US20220410315A1

公开(公告)日：2022-12-29

申请号：US17895403

申请日：2022-08-25

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Guang Lu

IPC: B23K26/08 ,  B23K26/082 ,  B23K26/12

Abstract: Varied embodiments of a laser-based machine tool, and techniques for controlling the same are provided. Some embodiments relate to techniques to facilitate uniform and reproducible processing of workpieces. Other embodiments relate to a zoom lens having a quickly-variable focal length. Still other embodiments relate to various features of a laser-based multi-axis machine tool that can facilitate efficient delivery of laser energy to a scan head, that can address thermomechanical issues that may arise during workpiece processing, etc. Another embodiment relates to techniques for minimizing or preventing undesired accumulation of particulate matter on workpiece surfaces during processing. A number of other embodiments and arrangements are also detailed.

公开(公告)号：US20220168847A1

公开(公告)日：2022-06-02

申请号：US17599756

申请日：2020-05-29

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Jan KLEINERT ,  Zhibin LIN ,  Joel SCHRAUBEN ,  Mark UNRATH ,  Honghua HU ,  Ruolin CHEN ,  Chuan YANG ,  Geoffrey LOTT ,  Daragh FINN

IPC: B23K26/362 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/06 ,  G02F1/33

Abstract: Numerous embodiments are disclosed. Many of which relate to methods of forming vias in workpieces such as printed circuit boards. Some embodiments relates techniques for indirectly ablating a region of an electrical conductor structure of, for example, a printed circuit board by spatially distributing laser energy throughout the region before the electrical conductor is indirectly ablated. Other embodiments relate to techniques for temporally-dividing laser pulses, modulating the optical power within laser pulses, and the like.

公开(公告)号：US11281069B2

公开(公告)日：2022-03-22

申请号：US16619875

申请日：2018-06-19

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： James Brookhyser ,  Kurt Eaton

IPC: G02F1/33 ,  G02F1/11 ,  H01S3/106

Abstract: A beam positioner includes a first acousto-optic (AO) deflector (AOD) comprising an AO cell and a transducer attached to the AO cell, and a wave plate optically contacted to the first AOD.

公开(公告)号：US20210276125A1

公开(公告)日：2021-09-09

申请号：US16499511

申请日：2018-04-30

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Guang LU ,  Brian Johansen ,  Mark Kosmowski ,  Ho Wai Lo ,  Guangyu Li

IPC: B23K26/08 ,  B23K26/082 ,  B23K26/12

Abstract: Varied embodiments of a laser-based machine tool, and techniques for controlling the same are provided. Some embodiments relate to techniques to facilitate uniform and reproducible processing of workpieces. Other embodiments relate to a zoom lens having a quickly-variable focal length. Still other embodiments relate to various features of a laser-based multi-axis machine tool that can facilitate efficient delivery of laser energy to a scan head, that can address thermomechanical issues that may arise during workpiece processing, etc. Another embodiment relates to techniques for minimizing or preventing undesired accumulation of particulate matter on workpiece surfaces during processing. A number of other embodiments and arrangements are also detailed.

公开(公告)号：US11077526B2

公开(公告)日：2021-08-03

申请号：US15750140

申请日：2016-09-08

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Jan Kleinert ,  Zhibin Lin ,  Hisashi Matsumoto

IPC: B23K26/08 ,  B23K26/382 ,  B23K26/082 ,  B23K26/0622 ,  B23K26/70 ,  B23K103/00

Abstract: Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.