An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame.