发明申请
- 专利标题: SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- 专利标题(中): 硅碳化硅半导体器件及其制造方法
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申请号: US12921250申请日: 2009-03-04
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公开(公告)号: US20110012133A1公开(公告)日: 2011-01-20
- 发明人: Shoyu Watanabe , Shuhei Nakata , Kenichi Ohtsuka
- 申请人: Shoyu Watanabe , Shuhei Nakata , Kenichi Ohtsuka
- 申请人地址: JP TOKYO
- 专利权人: MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人: MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人地址: JP TOKYO
- 优先权: JP2008-057696 20080307
- 国际申请: PCT/JP2009/000965 WO 20090304
- 主分类号: H01L29/772
- IPC分类号: H01L29/772 ; H01L21/20
摘要:
A silicon carbide MOSFET that exhibits a high source-to-drain withstand voltage and that involves a smaller difference between gate-to-drain capacitance achieved in an activated state and gate-to-drain capacitance achieved in a deactivated state. A silicon carbide drift layer of a first conductivity type is provided on a silicon carbide substrate of a first conductivity type; a pair of base regions are provided in a surface layer portion of the silicon carbide drift layer and exhibit a second conductivity type; a pair of source regions are provided in interiors of surface layer portions of the pair of base regions and exhibit a first conductivity type; and semi-insulating regions are provided between the silicon carbide substrate and the pair of base regions.
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