发明申请
- 专利标题： Silicon Carrier Structure and Method of Forming Same
- 专利标题（中）： 硅载体结构及其形成方法
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申请号： US12507591申请日： 2009-07-22
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公开(公告)号： US20110019368A1公开(公告)日： 2011-01-27
- 发明人: Paul Stephen Andry , Harm Peter Hofstee , George A. Katopis , John Ulrich Knickerbocker , Robert K. Montoye , Chirag S. Patel
- 申请人： Paul Stephen Andry , Harm Peter Hofstee , George A. Katopis , John Ulrich Knickerbocker , Robert K. Montoye , Chirag S. Patel
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; C23F1/00
摘要：
A silicon carrier structure for electronic packaging includes a base substrate, a silicon carrier substrate disposed on the base substrate, a memory chip disposed on the silicon carrier substrate, a microprocessor chip disposed on the silicon carrier substrate, an input/output chip disposed on the silicon carrier substrate, and a clocking chip disposed on the silicon carrier substrate.
公开/授权文献
- US08295056B2 Silicon carrier structure and method of forming same 公开/授权日：2012-10-23
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