Invention Application
- Patent Title: SUBSTRATE SUPPORT HAVING FLUID CHANNEL
- Patent Title (中): 基板支持流体通道
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Application No.: US12849012Application Date: 2010-08-02
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Publication No.: US20110024047A1Publication Date: 2011-02-03
- Inventor: Andrew NGUYEN , Wing Lau CHENG , Hiroji HANAWA , Semyon L. KATS , Kartik RAMASWAMY , Yan YE , Kwok Manus WONG , Daniel J. HOFFMAN , Tetsuya ISHIKAWA , Brian C. LUE
- Applicant: Andrew NGUYEN , Wing Lau CHENG , Hiroji HANAWA , Semyon L. KATS , Kartik RAMASWAMY , Yan YE , Kwok Manus WONG , Daniel J. HOFFMAN , Tetsuya ISHIKAWA , Brian C. LUE
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Main IPC: C23F1/08
- IPC: C23F1/08 ; C23C16/00 ; C23C16/458 ; H01L21/683

Abstract:
A support for a substrate processing chamber comprises a chuck having a substrate receiving surface, and a base comprising an upper wall comprising a recessed trench having (i) an attachment face at a first depth, and (ii) a fluid channel at a second depth. A lower wall is seated in the recessed trench and attached to the attachment face of the upper wall, to close the fluid channel. A fluid inlet is provided to supply a heat transfer fluid to the fluid channel and a fluid outlet provided to discharge the heat transfer fluid from the fluid channel.
Public/Granted literature
- US08279577B2 Substrate support having fluid channel Public/Granted day:2012-10-02
Information query
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