发明申请
- 专利标题: Optical wiring board having a core
- 专利标题(中): 具有芯的光线路板
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申请号: US12923993申请日: 2010-10-19
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公开(公告)号: US20110039076A1公开(公告)日: 2011-02-17
- 发明人: Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
- 申请人: Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2007-0117286 20071116
- 主分类号: B32B3/00
- IPC分类号: B32B3/00
摘要:
An optical wiring board having a core, the optical wiring board including: a lower cladding; a side cladding formed over the lower cladding and having an indentation formed therein, the indentation being in correspondence with the core; a core embedded in the indentation; and an upper cladding covering the core, wherein a height of the core is different from a depth of the indentation