This invention relates to a method for producing a cured film, which comprises a first step of applying a curable resin composition onto a surface of a first substrate and a surface of a second substrate respectively; a second step of bonding the curable resin composition layers provided on each surface of the first and second substrates to each other; and a third step of curing the curable resin composition layer between the first and the second substrates. The present invention enables production of a cured film in which the amount of thermal deformation such as warpage upon heating/cooling is suppressed, and the film can be suitably used as a plastic substrate for a display such as a liquid crystal display device and an organic EL display device, a substrate for a display, such as a substrate for electronic paper and the like, and a substrate for a solar cell.