发明申请
- 专利标题: PHOTORESIST COATING AND DEVELOPING APPARATUS, SUBSTRATE TRANSFER METHOD AND INTERFACE APPARATUS
- 专利标题(中): 光电涂层和开发设备,基板传输方法和接口设备
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申请号: US12940101申请日: 2010-11-05
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公开(公告)号: US20110117492A1公开(公告)日: 2011-05-19
- 发明人: Yoshiaki Yamada , Yuichi Yamamoto , Hitoshi Kosugi
- 申请人: Yoshiaki Yamada , Yuichi Yamamoto , Hitoshi Kosugi
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 优先权: JP2009-259872 20091113
- 主分类号: G03F7/004
- IPC分类号: G03F7/004 ; C23C14/00
摘要:
A photoresist coating and developing apparatus 1 includes a photoresist film forming unit that forms a photoresist film on a substrate; a heat treatment unit that heats the substrate on which the photoresist film is formed by the photoresist film forming unit; a cooling unit that cools the substrate, on which the photoresist film is formed and which is heated by the heat treatment unit, to normal temperature; a heating unit 61 that heats the substrate, which is cooled to normal temperature by the cooling unit, to a predetermined temperature; a load-lock chamber L1 that unloads the substrate under depressurized atmosphere to expose the photoresist film; and a transfer device 62 that transfers the substrate from the heating unit 61 to the load-lock chamber L1.