发明申请
- 专利标题： Microelectromechanical Systems Embedded in a Substrate
- 专利标题（中）： 嵌入基板的微机电系统
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申请号： US12695543申请日： 2010-01-28
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公开(公告)号： US20110180926A1公开(公告)日： 2011-07-28
- 发明人: Milind P. Shah , Mario Francisco Velez , Fifin Sweeney
- 申请人： Milind P. Shah , Mario Francisco Velez , Fifin Sweeney
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM INCORPORATED
- 当前专利权人： QUALCOMM INCORPORATED
- 当前专利权人地址： US CA San Diego
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/58
摘要：
An integrated circuit package includes a microelectromechanical systems (MEMS) device embedded in a packaging substrate. The MEMS device is located on a die embedded in the packaging substrate and covered by a hermetic seal. Low-stress material in the packaging substrate surrounds the MEMS device. Additionally, interconnects may be used as standoffs to reduce stress on the MEMS device. The MEMS device is embedded a distance into the packaging substrate leaving for example, 30-80 microns, between the hermetic seal of the MEMS device and the support surface of the packaging substrate. Embedding the MEMS device results in lower stress on the MEMS device.
公开/授权文献
- US08847375B2 Microelectromechanical systems embedded in a substrate 公开/授权日：2014-09-30