Improved systems, methods and compositions for plasma enhanced atomic layer deposition are herein disclosed. According to one embodiment, a method includes exposing a substrate to a first process material to form a film comprising at least a portion of the first process material at a surface of the substrate. The substrate is exposed to a second process material and the second process material is activated into plasma to initiate a reaction between at least a portion of the first process material and at least a portion of the second process material at the surface of the substrate.