发明申请
- 专利标题： LED PACKAGE
- 专利标题（中）： LED封装
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申请号： US12886124申请日： 2010-09-20
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公开(公告)号： US20110186875A1公开(公告)日： 2011-08-04
- 发明人: Hidenori Egoshi , Kazuhiro Tamura , Hiroaki Oshio , Satoshi Shimizu , Teruo Takeuchi , Kazuhiro Inoue , Iwao Matsumoto
- 申请人： Hidenori Egoshi , Kazuhiro Tamura , Hiroaki Oshio , Satoshi Shimizu , Teruo Takeuchi , Kazuhiro Inoue , Iwao Matsumoto
- 申请人地址： JP Tokyo
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： JP Tokyo
- 优先权： JP2010-019781 20100129; JP2010-143663 20100624
- 主分类号： H01L33/48
- IPC分类号： H01L33/48
摘要：
According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.
公开/授权文献
- US08487418B2 LED package 公开/授权日：2013-07-16
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