公开(公告)号：US08525202B2

公开(公告)日：2013-09-03

申请号：US12849102

申请日：2010-08-03

申请人： Gen Watari ,  Satoshi Shimizu ,  Mami Yamamoto ,  Hidenori Egoshi ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi

发明人： Gen Watari ,  Satoshi Shimizu ,  Mami Yamamoto ,  Hidenori Egoshi ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi

IPC分类号： H01L33/00

CPC分类号： H01L24/97 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框架彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，并且LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。 此外，树脂体覆盖第一和第二引线框架和LED芯片，并且具有表面粗糙度为0.15μm或更高的上表面和具有高于上表面的表面粗糙度的表面粗糙度的侧表面。

公开(公告)号：US20110186900A1

公开(公告)日：2011-08-04

申请号：US12849102

申请日：2010-08-03

申请人： Gen Watari ,  Satoshi Shimizu ,  Mami Yamamoto ,  Hidenori Egoshi ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi

发明人： Gen Watari ,  Satoshi Shimizu ,  Mami Yamamoto ,  Hidenori Egoshi ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi

IPC分类号： H01L33/52 ,  H01L33/62

CPC分类号： H01L24/97 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，并且LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。 此外，树脂体覆盖第一和第二引线框架和LED芯片，并且具有表面粗糙度为0.15μm以上的上表面和具有高于上表面的表面粗糙度的表面粗糙度的侧表面。

公开(公告)号：US20130307014A1

公开(公告)日：2013-11-21

申请号：US13614779

申请日：2012-09-13

申请人： Mami Yamamoto ,  Kazuhiro Inoue ,  Yasunori Nagahata ,  Teruo Takeuchi ,  Hidenori Egoshi

发明人： Mami Yamamoto ,  Kazuhiro Inoue ,  Yasunori Nagahata ,  Teruo Takeuchi ,  Hidenori Egoshi

IPC分类号： H01L33/52

CPC分类号： H01L33/62 ,  H01L24/97 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0095 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to an embodiment, a semiconductor light emitting device includes a insulating base and a semiconductor light emitting element and resin. The insulating base includes a first face, a second face opposite to the first face, and a side face connecting to the first face and the second face, a recess portion being provided on the side face extending from the first face to the second face. The insulating base also includes a first metal layer blocking an opening of the recess portion, a second metal layer on an inner face of the recess portion, and a third metal layer on the second face, the third metal being electrically connected to the first metal layer via the second metal layer. A semiconductor light emitting element is fixed on the first face; and resin covers the first face and seals the semiconductor light emitting element.

摘要翻译： 根据实施例，半导体发光器件包括绝缘基底和半导体发光元件和树脂。 所述绝缘底座包括第一面，与所述第一面相反的第二面以及与所述第一面和所述第二面连接的侧面，在从所述第一面向所述第二面延伸的侧面设置有凹部。 绝缘基底还包括阻挡凹部的开口的第一金属层，凹部的内表面上的第二金属层和第二面上的第三金属层，第三金属电连接到第一金属 层经由第二金属层。 半导体发光元件固定在第一面上; 并且树脂覆盖第一面并密封半导体发光元件。

公开(公告)号：US20110186875A1

公开(公告)日：2011-08-04

申请号：US12886124

申请日：2010-09-20

申请人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

发明人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

IPC分类号： H01L33/48

CPC分类号： H01L33/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.

摘要翻译： 根据一个实施例，LED封装包括（2×n）（n为2以上的整数）引线框，n个LED芯片和树脂体。 （2×n）个引线框架彼此分开布置。 n个LED芯片设置在引线框架的上方。 n个LED芯片中的每一个具有连接到（2×n）个引线框架的n个引线框架中的每一个的一个端子，以及连接到除了n个引线框架之外的（2×n）个引线框架的每个引线框架的另一个端子。 树脂体覆盖（2×n）引线框和n个LED芯片。

公开(公告)号：USD515519S1

公开(公告)日：2006-02-21

申请号：US29226916

申请日：2005-04-05

申请人： Hidenori Egoshi ,  Hiroaki Oshio

设计人： Hidenori Egoshi ,  Hiroaki Oshio

公开(公告)号：US08637892B2

公开(公告)日：2014-01-28

申请号：US12886890

申请日：2010-09-21

申请人： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

发明人： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

IPC分类号： H01L33/00

CPC分类号： H01L24/97 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，LED芯片包括至少包含铟，镓和铝的半导体层，LED芯片的一个端子连接到第一引线框架，LED的另一个端子 芯片连接到第二引线框架。 树脂体覆盖LED芯片，并且整个上表面，下表面的一部分和第一引线框架和第二引线框架中的每一个的边缘表面的一部分，并且树脂体暴露下表面的其余部分 边缘表面。 并且，树脂体的外观是LED封装的外观的一部分。

公开(公告)号：US08487418B2

公开(公告)日：2013-07-16

申请号：US12886124

申请日：2010-09-20

申请人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

发明人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

IPC分类号： H01L23/495

CPC分类号： H01L33/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.

摘要翻译： 根据一个实施例，LED封装包括（2×n）（n为2以上的整数）引线框，n个LED芯片和树脂体。 （2×n）个引线框架彼此分开布置。 n个LED芯片设置在引线框架的上方。 n个LED芯片中的每一个具有连接到（2×n）个引线框架的n个引线框架中的每一个的一个端子，以及连接到除了n个引线框架之外的（2×n）个引线框架的每个引线框架的另一个端子。 树脂体覆盖（2×n）引线框和n个LED芯片。

公开(公告)号：US20120273826A1

公开(公告)日：2012-11-01

申请号：US13234792

申请日：2011-09-16

申请人： Mami Yamamoto ,  Kazuhiro Inoue ,  Satoshi Shimizu ,  Hidenori Egoshi ,  Yasunori Nagahata

发明人： Mami Yamamoto ,  Kazuhiro Inoue ,  Satoshi Shimizu ,  Hidenori Egoshi ,  Yasunori Nagahata

IPC分类号： H01L33/36 ,  H01L33/52

CPC分类号： H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/54 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/78301 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： According to one embodiment, an LED package includes a first leadframe and a second leadframe mutually-separated, an LED chip and a resin body. The LED chip is provided above the first and second leadframes. One terminal of the LED chip is connected to the first leadframe. One other terminal is connected to the second leadframe. The resin body covers an entire upper surface, a portion of a lower surface, and a portion of an end surface of each of the first and second leadframes. The resin body covers the LED chip. Remaining portions of the lower surface and the end surface of each of the first and second leadframes are exposed on the resin body. First and second recesses are made between the remaining portions of the first and second leadframes. An inner surface of each of the first and second recesses is not covered with the resin body.

摘要翻译： 根据一个实施例，LED封装包括相互分离的第一引线框架和第二引线框架，LED芯片和树脂体。 LED芯片设置在第一引线框架和第二引线框架之上。 LED芯片的一个端子连接到第一引线框架。 另一个终端连接到第二引线框。 树脂体覆盖整个上表面，下表面的一部分和第一引线框和第二引线框中的每一个的端面的一部分。 树脂体覆盖LED芯片。 第一引线框架和第二引线框架的每个的下表面和端表面的剩余部分暴露在树脂体上。 在第一引线框架和第二引线框架的其余部分之间形成第一和第二凹槽。 第一和第二凹部中的每一个的内表面不被树脂体覆盖。

公开(公告)号：US20110186902A1

公开(公告)日：2011-08-04

申请号：US12886890

申请日：2010-09-21

申请人： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

发明人： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

IPC分类号： H01L33/48 ,  H01L33/62

CPC分类号： H01L24/97 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，LED芯片包括至少包含铟，镓和铝的半导体层，LED芯片的一个端子连接到第一引线框架，LED的另一个端子 芯片连接到第二引线框架。 树脂体覆盖LED芯片，并且整个上表面，下表面的一部分和第一引线框架和第二引线框架中的每一个的边缘表面的一部分，并且树脂体暴露下表面的其余部分 边缘表面。 并且，树脂体的外观是LED封装的外观的一部分。