摘要:
According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.
摘要:
According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.
摘要:
An LED package includes: 2n lead frames (n is a natural number); n LED chips provided above the 2n lead frames, one terminal of each of the n LED chips being connected to each of the n lead frames, another terminal of each of the n LED chips being connected to each of other n lead frames; a wire connected between the terminal and one of the lead frames; and a resin body covering the n LED chips, the wire, and a part of each of the 2n lead frames. The each of the 2n lead frames includes; a base having an upper surface and side surfaces, the upper surface and the side surfaces being covered with the resin body; and a plurality of extending portions extending from the base, one of the extending portions having tip surface which is exposed at one side surface of the resin body, another of the extending portions having tip surface which is exposed at another side surface of the resin body, the one side surface and the another side surface being perpendicular to each other, and. An outer shape of the resin body forms an outer shape of the LED package.
摘要:
A light emitting device includes a resin case including a concave portion with a reflector portion surrounding a light emitting element, a first lead and a second lead that are formed of a metal, exposed at a bottom of the concave portion of the case, and disposed away from each other in a predetermined direction, and a resin sealing material filled in the concave portion. The first lead includes a light emitting element mounting portion, a first wire connection portion, a first bleed-out preventing notch, and an opposite notch. The second lead includes a protective device mounting portion, a second wire connection portion, and a second bleed-out preventing notch. The first lead and the second lead are arranged such that, in the predetermined direction, the light emitting element mounting portion is opposed to the second bleed-out preventing notch, the first wire connection portion is opposed to the protective device mounting portion, and the opposite notch is opposed to the second wire connection portion.
摘要:
A light emitting device includes a resin case including a concave portion with a reflector portion surrounding a light emitting element, a first lead and a second lead that are formed of a metal, exposed at a bottom of the concave portion of the case, and disposed away from each other in a predetermined direction, and a resin sealing material filled in the concave portion. The first lead includes a light emitting element mounting portion, a first wire connection portion, a first bleed-out preventing notch, and an opposite notch. The second lead includes a protective device mounting portion, a second wire connection portion, and a second bleed-out preventing notch. The first lead and the second lead are arranged such that, in the predetermined direction, the light emitting element mounting portion is opposed to the second bleed-out preventing notch, the first wire connection portion is opposed to the protective device mounting portion, and the opposite notch is opposed to the second wire connection portion.
摘要:
A card game apparatus includes a display to display a game scene. In the game scene, a first master display site and a second master display site are formed to respectively display therein a first master as the other self of a game player and a second master as the other self of an opponent. The game player is allowed to select a monster card from a card hand display site and present it to a monster card presenting site. Responsive to an instruction of attack with a monster card, an attack power of the monster card is compared with the HP of a designated second master or the monster presented in the monster card presenting site, thereby arithmetically determining a battle result.
摘要:
A semiconductor device adopting shallow trench isolation for reducing an internal stress of a semiconductor substrate. The semiconductor device is composed of a semiconductor substrate provided with a trench for isolation, and an insulating film formed to cover the trench for relaxing an internal stress of the semiconductor substrate. The insulating film includes a first portion disposed to be opposed to a bottom of the trench, and a second portion disposed to be opposed to a side of the trench. A first thickness of the first portion is different from a second thickness of the second portion.
摘要:
A semiconductor light emitting element exhibiting a characteristic of deflected luminous intensity distribution, a semiconductor light emitting device capable of making, even when the element is off the center, a luminous center close to the center, and an element scribing method having a high element separation rate without causing a crack and chipping of pellet edges. The semiconductor light emitting element involves the use of a scribed pellet 10 into which a wafer including a semiconductor layer such as a luminous layer that is stacked on a compound semiconductor substrate inclined at 5.degree. through 20.degree. to a surface (100) in a orientation [011], is subjected to an element separation process by a scribing method.
摘要:
The present invention provides a rotating-body support structure that is capable of obtaining a damping effect of a rotating body with a simple configuration. To this end, the rotating-body support structure is configured to include a housing (21) and a bush portion (24) which is supported by the housing (21) and which rotatably supports a boring bar (11); and to have oil filled between the housing (21) and the bush portion (24).
摘要:
A semiconductor device adopting shallow trench isolation for reducing an internal stress of a semiconductor substrate. The semiconductor device is composed of a semiconductor substrate provided with a trench for isolation, and an insulating film formed to cover the trench for relaxing an internal stress of the semiconductor substrate. The insulating film includes a first portion disposed to be opposed to a bottom of the trench, and a second portion disposed to be opposed to a side of the trench. A first thickness of the first portion is different from a second thickness of the second portion.