发明申请
US20110223749A1 METHOD OF FORMING NITRIDE SEMICONDUCTOR EPITAXIAL LAYER AND METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE
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形成氮化物半导体外延层的方法和制备氮化物半导体器件的方法
- 专利标题: METHOD OF FORMING NITRIDE SEMICONDUCTOR EPITAXIAL LAYER AND METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE
- 专利标题(中): 形成氮化物半导体外延层的方法和制备氮化物半导体器件的方法
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申请号: US12913062申请日: 2010-10-27
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公开(公告)号: US20110223749A1公开(公告)日: 2011-09-15
- 发明人: Hiromu SHIOMI , Yu Saitoh , Kazuhide Sumiyoshi , Akihiro Hachigo , Makoto Kiyama , Seiji Nakahata
- 申请人: Hiromu SHIOMI , Yu Saitoh , Kazuhide Sumiyoshi , Akihiro Hachigo , Makoto Kiyama , Seiji Nakahata
- 申请人地址: JP Osaka-shi
- 专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人地址: JP Osaka-shi
- 优先权: JP2010-010158 20100120
- 主分类号: H01L21/205
- IPC分类号: H01L21/205 ; H01L21/3063
摘要:
The present method of forming a nitride semiconductor epitaxial layer includes the steps of growing at least one layer of nitride semiconductor epitaxial layer on a nitride semiconductor substrate having a dislocation density lower than or equal to 1×107 cm−2 with a chemical decomposition layer interposed therebetween, the chemical decomposition layer being chemically decomposed at least with either a gas or an electrolytic solution, and decomposing the chemical decomposition layer at least with either the gas or the electrolytic solution at least either during or after the step of growing the nitride semiconductor epitaxial layer, thereby separating the nitride semiconductor epitaxial layer from the nitride semiconductor substrate. A high-quality nitride semiconductor epitaxial layer suffering less damage when separated from the nitride semiconductor substrate is thereby formed.
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