发明申请
- 专利标题： LEADFRAME PACKAGE FOR HIGH-SPEED DATA RATE APPLICATIONS
- 专利标题（中）： LEADFRAME包用于高速数据速率应用
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申请号： US13085446申请日： 2011-04-12
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公开(公告)号： US20110248394A1公开(公告)日： 2011-10-13
- 发明人: Nan-Jang Chen , Chun-Wei Chang , Sheng-Ming Chang , Che-Yuan Jao , Ching-Chih Li , Nan-Cheng Chen
- 申请人： Nan-Jang Chen , Chun-Wei Chang , Sheng-Ming Chang , Che-Yuan Jao , Ching-Chih Li , Nan-Cheng Chen
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm.
公开/授权文献
- US08525310B2 Leadframe package for high-speed data rate applications 公开/授权日：2013-09-03