公开(公告)号：US20110248394A1

公开(公告)日：2011-10-13

申请号：US13085446

申请日：2011-04-12

申请人： Nan-Jang Chen ,  Chun-Wei Chang ,  Sheng-Ming Chang ,  Che-Yuan Jao ,  Ching-Chih Li ,  Nan-Cheng Chen

发明人： Nan-Jang Chen ,  Chun-Wei Chang ,  Sheng-Ming Chang ,  Che-Yuan Jao ,  Ching-Chih Li ,  Nan-Cheng Chen

IPC分类号： H01L23/495

CPC分类号： H01L24/49 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm.

摘要翻译： 半导体封装包括管芯焊盘; 安装在管芯焊盘上的半导体管芯; 沿着所述管芯焊盘的周缘设置的多个引线; 引线和芯片焊盘之间的接地棒; 以及将接地棒与管芯焊盘连接的多个桥，其中两个相邻桥之间的间隙具有等于或小于3mm的长度。

公开(公告)号：US08525310B2

公开(公告)日：2013-09-03

申请号：US13085446

申请日：2011-04-12

申请人： Nan-Jang Chen ,  Chun-Wei Chang ,  Sheng-Ming Chang ,  Che-Yuan Jao ,  Ching-Chih Li ,  Nan-Cheng Chen

发明人： Nan-Jang Chen ,  Chun-Wei Chang ,  Sheng-Ming Chang ,  Che-Yuan Jao ,  Ching-Chih Li ,  Nan-Cheng Chen

IPC分类号： H01L23/495

CPC分类号： H01L24/49 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm.

摘要翻译： 半导体封装包括管芯焊盘; 安装在管芯焊盘上的半导体管芯; 沿着所述管芯焊盘的周缘设置的多个引线; 引线和芯片焊盘之间的接地棒; 以及将接地棒与管芯焊盘连接的多个桥，其中两个相邻桥之间的间隙具有等于或小于3mm的长度。

公开(公告)号：US20100207260A1

公开(公告)日：2010-08-19

申请号：US12766080

申请日：2010-04-23

申请人： Nan-Cheng Chen ,  Nan-Jang Chen ,  Ching-Chih Li

发明人： Nan-Cheng Chen ,  Nan-Jang Chen ,  Ching-Chih Li

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic package is provided. The electronic package comprises a die pad having a die attached thereon. A plurality of leads surrounds the die pad and spaced therefrom to define a ring gap therebetween. At least one first common electrode bar is in the ring gap and substantially coplanar to the die pad, in which at least one of the plurality of leads extends to the first common electrode bar. A molding compound partially encapsulates the die pad and the first common electrode bar, such that the bottom surfaces of the die pad and the first common electrode bar are exposed. A length of the first common electrode bar is substantially equal to a predetermined distance between two pads among a plurality of power or ground pads on a side of the die facing the first common electrode bar. An electronic device with the electronic package is also disclosed.

摘要翻译： 提供电子包装。 电子封装包括其上附着有管芯的管芯焊盘。 多个引线围绕芯片焊盘并与其间隔开以在其间限定环形间隙。 至少一个第一公共电极棒处于环形间隙中并且基本上与芯片焊盘共面，其中多个引线中的至少一个延伸到第一公共电极棒。 模塑料部分地封装芯片焊盘和第一公共电极棒，使得裸片焊盘和第一公共电极棒的底表面露出。 第一公共电极棒的长度基本上等于面对第一公共电极棒的模具一侧的多个电源或接地焊盘中的两个焊盘之间的预定距离。 还公开了一种具有电子封装的电子设备。

公开(公告)号：US08283757B2

公开(公告)日：2012-10-09

申请号：US12766080

申请日：2010-04-23

申请人： Nan-Cheng Chen ,  Nan-Jang Chen ,  Ching-Chih Li

发明人： Nan-Cheng Chen ,  Nan-Jang Chen ,  Ching-Chih Li

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic package is provided. The electronic package comprises a die pad having a die attached thereon. A plurality of leads surrounds the die pad and spaced therefrom to define a ring gap therebetween. At least one first common electrode bar is in the ring gap and substantially coplanar to the die pad, in which at least one of the plurality of leads extends to the first common electrode bar. A molding compound partially encapsulates the die pad and the first common electrode bar, such that the bottom surfaces of the die pad and the first common electrode bar are exposed. A length of the first common electrode bar is substantially equal to a predetermined distance between two pads among a plurality of power or ground pads on a side of the die facing the first common electrode bar. An electronic device with the electronic package is also disclosed.

摘要翻译： 提供电子包装。 电子封装包括其上附着有管芯的管芯焊盘。 多个引线围绕芯片焊盘并与其间隔开以在其间限定环形间隙。 至少一个第一公共电极棒处于环形间隙中并且基本上与芯片焊盘共面，其中多个引线中的至少一个延伸到第一公共电极棒。 模塑料部分地封装芯片焊盘和第一公共电极棒，使得裸片焊盘和第一公共电极棒的底表面露出。 第一公共电极棒的长度基本上等于面对第一公共电极棒的模具一侧的多个电源或接地焊盘中的两个焊盘之间的预定距离。 还公开了一种具有电子封装的电子设备。

公开(公告)号：US08350380B2

公开(公告)日：2013-01-08

申请号：US13346641

申请日：2012-01-09

申请人： Nan-Jang Chen ,  Hong-Chin Lin

发明人： Nan-Jang Chen ,  Hong-Chin Lin

IPC分类号： H01L21/00

CPC分类号： H01L23/49531 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/66 ,  H01L24/14 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4847 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19015 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.

摘要翻译： 引线框封装包括具有四个一体的向外延伸的细长条的管芯焊盘; 沿所述管芯焊盘的周边布置的多个引线; 与所述管芯焊盘分离并与所述多个引线隔离的单独焊盘段; 安装在所述管芯焊盘的上侧的半导体管芯，其中，所述半导体管芯包含与所述多个引线引线接合的第一接合焊盘和与所述独立焊盘区段焊接的第二接合焊盘; 以及封装半导体管芯的模塑料，管芯焊盘的上侧，第一悬挂焊盘段和多个引线的内部。

公开(公告)号：US08120927B2

公开(公告)日：2012-02-21

申请号：US12098474

申请日：2008-04-07

申请人： Nan-Jang Chen ,  Hong-Chin Lin

发明人： Nan-Jang Chen ,  Hong-Chin Lin

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K1/0216 ,  H01L2924/0002 ,  H05K3/222 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/10363 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

摘要： A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't pass over any split of the ground plane.

摘要翻译： 公开了印刷电路板。 印刷电路板包括具有顶表面和底表面的基底。 地平面位于底面。 信号迹线沿着第一方向在顶表面上。 至少两个隔离的电源平面分别位于与信号迹线的相对侧相邻的顶表面上。 沿着第二方向的导电连接在信号迹线上耦合到两个电源层，而不与电信号迹线电连接，其中信号迹线不经过接地层的任何分裂。

公开(公告)号：US20110012244A1

公开(公告)日：2011-01-20

申请号：US12889680

申请日：2010-09-24

申请人： Nan-Jang Chen

发明人： Nan-Jang Chen

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor chip package comprises a lead frame having a chip carrier having a first surface and an opposite second surface. A first semiconductor chip is mounted on the first surface, having a plurality of bonding pads thereon, wherein the first semiconductor chip has an area larger that that of the chip carrier. A package substrate has a central region attached to the second surface of the chip carrier, having an area larger than that of the first semiconductor chip, wherein the package substrate comprises a plurality of fingers on a top surface thereof in a marginal region of the package substrate, which are arranged in an array with a row of inner fingers adjacent to the first semiconductor chip and a row of outer fingers adjacent to an edge of the package substrate, wherein the inner and outer fingers are electrically connected to the bonding pads of the first semiconductor chip and the lead frame respectively.

公开(公告)号：US07834436B2

公开(公告)日：2010-11-16

申请号：US12266601

申请日：2008-11-07

申请人： Nan-Jang Chen

发明人： Nan-Jang Chen

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An image processing system including an image processing device and a service providing device is provided. The image processing device includes a first processor and a first memory storing instructions that cause the image processing device to obtain parameters for receiving the service from the service providing device, request the service providing device to provide the service and implement a first or second function of the image processing device based on the parameters obtained from the parameter specifying unit. The service providing device includes a second processor and a second memory storing instructions that cause the service providing device to execute a service function to provide the service to the image processing device after receiving a request for the service from the image processing device.

摘要翻译： 半导体芯片封装包括具有芯片载体的引线框架，芯片载体具有第一表面和相对的第二表面。 第一半导体芯片安装在第一表面上，其上具有多个焊盘，其中第一半导体芯片的面积大于芯片载体的面积。 封装衬底具有附接到芯片载体的第二表面的中心区域，其具有大于第一半导体芯片的面积的区域，其中封装衬底在其封装的边缘区域中包括在其顶表面上的多个指状物 衬底，其布置成具有与第一半导体芯片相邻的一列内指的阵列，以及与封装衬底的边缘相邻的一排外指，其中内指和外指电连接到 第一半导体芯片和引线框架。

公开(公告)号：US08288848B2

公开(公告)日：2012-10-16

申请号：US13208115

申请日：2011-08-11

申请人： Nan-Jang Chen

发明人： Nan-Jang Chen

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49531 ,  H01L23/13 ,  H01L23/49503 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor chip package is provided. The semiconductor chip package includes a lead frame having a chip carrier. A semiconductor chip is mounted on the chip carrier, having a plurality of bonding pads thereon. A package substrate has a cavity therein to accommodate the chip carrier and the semiconductor chip, wherein at least one of the bonding pads of the semiconductor chip is electrically coupled to the package substrate.

摘要翻译： 提供半导体芯片封装。 半导体芯片封装包括具有芯片载体的引线框架。 半导体芯片安装在芯片载体上，其上具有多个接合焊盘。 封装衬底在其中具有腔以容纳芯片载体和半导体芯片，其中半导体芯片的至少一个焊盘电连接到封装衬底。

公开(公告)号：US20120104588A1

公开(公告)日：2012-05-03

申请号：US13346641

申请日：2012-01-09

申请人： Nan-Jang Chen ,  Hong-Chin Lin

发明人： Nan-Jang Chen ,  Hong-Chin Lin

IPC分类号： H01L23/495

CPC分类号： H01L23/49531 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/66 ,  H01L24/14 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4847 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19015 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.

摘要翻译： 引线框封装包括具有四个一体的向外延伸的细长条的管芯焊盘; 沿所述管芯焊盘的周边布置的多个引线; 与所述管芯焊盘分离并与所述多个引线隔离的单独焊盘段; 安装在所述管芯焊盘的上侧的半导体管芯，其中，所述半导体管芯包含与所述多个引线引线接合的第一接合焊盘和与所述独立焊盘区段焊接的第二接合焊盘; 以及封装半导体管芯的模塑料，管芯焊盘的上侧，第一悬挂焊盘段和多个引线的内部。