发明申请
US20110266687A1 ELECTRONIC ELEMENTS AND DEVICES WITH TRENCH UNDER BOND PAD FEATURE
有权
电子元件和装置,具有绑定功能的底板
- 专利标题: ELECTRONIC ELEMENTS AND DEVICES WITH TRENCH UNDER BOND PAD FEATURE
- 专利标题(中): 电子元件和装置,具有绑定功能的底板
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申请号: US13179295申请日: 2011-07-08
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公开(公告)号: US20110266687A1公开(公告)日: 2011-11-03
- 发明人: Jeffrey K. Jones , Margaret A. Szymanowski , Michele L. Miera , Xiaowei Ren , Wayne R. Burger , Mark A. Bennett , Colin Kerr
- 申请人: Jeffrey K. Jones , Margaret A. Szymanowski , Michele L. Miera , Xiaowei Ren , Wayne R. Burger , Mark A. Bennett , Colin Kerr
- 申请人地址: US TX Austin
- 专利权人: FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人: FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人地址: US TX Austin
- 主分类号: H01L23/488
- IPC分类号: H01L23/488
摘要:
Electronic elements having an active device region and bonding pad (BP) region on a common substrate desirably include a dielectric region underlying the BP to reduce the parasitic impedance of the BP and its interconnection as the electronic elements are scaled to higher power and/or operating frequency. Mechanical stress created by plain (e.g., oxide only) dielectric regions can adversely affect performance, manufacturing yield, pad-to-device proximity and occupied area. This can be avoided by providing a composite dielectric region having electrically isolated inclusions of a thermal expansion coefficient (TEC) less than that of the dielectric material in which they are embedded and/or closer to the substrate TEC. For silicon substrates, poly or amorphous silicon is suitable for the inclusions and silicon oxide for the dielectric material. The inclusions preferably have a blade-like shape separated by and enclosed within the dielectric material.
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