发明申请
- 专利标题： WIRING BOARD, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHODS THEREOF
- 专利标题（中）： 接线板，半导体器件及其制造方法
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申请号： US13161871申请日： 2011-06-16
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公开(公告)号： US20110316057A1公开(公告)日： 2011-12-29
- 发明人: Motomu KURATA , Shinya SASAGAWA , Fumika TAGUCHI , Yoshinori IEDA
- 申请人： Motomu KURATA , Shinya SASAGAWA , Fumika TAGUCHI , Yoshinori IEDA
- 申请人地址： JP Atsugi
- 专利权人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人地址： JP Atsugi
- 优先权： JP2010-148134 20100629
- 主分类号： H01L29/78
- IPC分类号： H01L29/78 ; H05K1/00 ; H01L21/3213 ; H01L21/321
摘要：
It is an object to reduce defective conduction in a wiring board or a semiconductor device whose integration degree is increased. It is another object to manufacture a highly reliable wiring board or semiconductor device with high yield. In a wiring board or a semiconductor device having a multilayer wiring structure, a conductive layer having a curved surface is used in connection between conductive layers used for the wirings. The top of a conductive layer in a lower layer exposed by removal of an insulating layer therearound has a curved surface, so that coverage of the conductive layer in the lower layer with a conductive layer in an upper layer stacked thereover can be favorable. A conductive layer is etched using a resist mask having a curved surface, so that a conductive layer having a curved surface is formed.
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