发明申请
- 专利标题: Method of manufacturing substrate using a carrier
- 专利标题(中): 使用载体制造衬底的方法
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申请号: US13137631申请日: 2011-08-30
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公开(公告)号: US20110318480A1公开(公告)日: 2011-12-29
- 发明人: Ki Hwan Kim , Jin Yong An , Myung Sam Kang
- 申请人: Ki Hwan Kim , Jin Yong An , Myung Sam Kang
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2008-0128642 20081217
- 主分类号: H05K3/00
- IPC分类号: H05K3/00
摘要:
A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.
公开/授权文献
- US08677618B2 Method of manufacturing substrate using a carrier 公开/授权日:2014-03-25