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    Method of manufacturing substrate using a carrier
    1.
    发明申请
    Method of manufacturing substrate using a carrier 失效
    使用载体制造衬底的方法

    公开(公告)号：US20110318480A1

    公开(公告)日：2011-12-29

    申请号：US13137631

    申请日：2011-08-30

    Applicant: Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    Inventor： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    IPC: H05K3/00

    CPC classification number: H05K3/0097 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/1536

    Abstract: A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

    Abstract translation: 使用载体制造衬底的方法，其包括制备具有释放层的载体，以及顺序地设置在释放层两侧的绝缘层和金属层; 图案化金属层以形成基极电路层; 在基极电路层上形成积层; 执行布线过程以将绝缘层与释放层分离; 以及在堆积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。

    Method of manufacturing substrate using a carrier
    2.
    发明授权
    Method of manufacturing substrate using a carrier 失效
    使用载体制造衬底的方法

    公开(公告)号：US08677618B2

    公开(公告)日：2014-03-25

    申请号：US13137631

    申请日：2011-08-30

    Applicant: Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    Inventor： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    IPC: H05K3/02 ,  H05K3/10

    CPC classification number: H05K3/0097 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/1536

    Abstract: A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

    Abstract translation: 使用载体制造衬底的方法，其包括制备具有释放层的载体，以及顺序地设置在释放层两侧的绝缘层和金属层; 图案化金属层以形成基极电路层; 在基极电路层上形成积层; 执行布线过程以将绝缘层与释放层分离; 以及在堆积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。

    Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier
    3.
    发明申请
    Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier 审中-公开
    用于制造基板的载体和使用载体制造基板的方法

    公开(公告)号：US20100147559A1

    公开(公告)日：2010-06-17

    申请号：US12382359

    申请日：2009-03-13

    Applicant: Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    Inventor： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    IPC: H05K1/02 ,  H05K3/02

    CPC classification number: H05K3/0097 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/1536

    Abstract: The invention relates to a carrier used in the manufacture of a substrate and a method of manufacturing a substrate using the carrier, the method including (A) preparing a carrier comprising a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; (B) patterning the metal layers to form base circuit layers; (C) forming buildup layers on the base circuit layers; (D) executing a routing process to separate the insulating layers from the releasing layer; and (E) forming solder-resist layers on the buildup layers and forming openings in-the solder-resist layers and the insulating layers to expose pads.

    Abstract translation: 本发明涉及用于制造基板的载体和使用该载体制造基板的方法，该方法包括：（A）制备包括释放层的载体，以及顺序地设置在两侧的绝缘层和金属层 释放层; （B）图案化金属层以形成基极电路层; （C）在基极电路层上形成积层; （D）执行路由处理以将绝缘层与释放层分离; 和（E）在积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。

    Dual mode terminal supporting location-based services and control method for the same
    8.
    发明授权
    Dual mode terminal supporting location-based services and control method for the same 有权
    双模终端支持基于位置的服务和控制方法相同

    公开(公告)号：US08208944B2

    公开(公告)日：2012-06-26

    申请号：US12829336

    申请日：2010-07-01

    Applicant: Ki Hwan Kim ,  Seong Jin Park ,  Woo Yol Kim

    Inventor： Ki Hwan Kim ,  Seong Jin Park ,  Woo Yol Kim

    IPC: H04W24/00

    CPC classification number: H04W88/06 ,  G01S19/258 ,  H04W4/02

    Abstract: A dual mode terminal for providing location-based services is provided. The dual mode terminal includes a first area including a first wireless communication unit for communication with a first communication network and a first processor for processing signals transmitted and received to and from the first communication network, and a second area including a second wireless communication unit for communication with a second communication network and a second processor for processing signals transmitted and received to and from the second communication network. The first wireless communication unit includes a GPS receiver for receiving satellite GPS signals. The first processor includes a GPS engine for processing network location information received from the first communication network and the second communication network, and the second processor transfers network location information received from the second communication network to the first processor.

    Abstract translation: 提供了一种用于提供基于位置的服务的双模终端。 双模终端包括：第一区域，包括用于与第一通信网络通信的第一无线通信单元和用于处理从第一通信网络发送和接收信号的第一处理器;以及第二区域，包括第二无线通信单元，用于 与第二通信网络和第二处理器的通信，用于处理从第二通信网络发送和接收的信号。 第一无线通信单元包括用于接收卫星GPS信号的GPS接收器。 第一处理器包括用于处理从第一通信网络和第二通信网络接收的网络位置信息的GPS引擎，并且第二处理器将从第二通信网络接收的网络位置信息传送到第一处理器。

    METHOD AND APPARATUS FOR TRANSMITTING SIGNALS SEGMENTATION
    9.
    发明申请
    METHOD AND APPARATUS FOR TRANSMITTING SIGNALS SEGMENTATION 失效
    用于发送信号分类的方法和装置

    公开(公告)号：US20110261775A1

    公开(公告)日：2011-10-27

    申请号：US13139717

    申请日：2009-11-10

    Applicant: Ki Hwan Kim ,  Jae Hoon Chung ,  Yeong Hyeon Kwon

    Inventor： Ki Hwan Kim ,  Jae Hoon Chung ,  Yeong Hyeon Kwon

    IPC: H04W72/04

    CPC classification number: H04L1/0042 ,  H04B7/0426 ,  H04B7/0617 ,  H04L1/0057 ,  H04L1/0067 ,  H04L1/1812 ,  H04L27/2601

    Abstract: A method for transmitting a transport block includes segmenting the transport block into code blocks corresponding in number to a multiple of the number of layers to be used for the transmission of the transport block, attaching a Cyclic Redundancy Check (CRC) to the segmented code blocks, sequentially mapping the code blocks to which the CRC has been attached to at least one layer according to a predetermined mapping rule, and transmitting the code blocks.

    Abstract translation: 一种用于发送传输块的方法包括：将传输块分割为与要用于传输块的传输的层数的倍数相对应的码块，将循环冗余校验（CRC）附加到分段的码块 根据预定的映射规则顺序地将已经附加了CRC的代码块映射到至少一个层，并且发送代码块。

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